US2017200608A1PendingUtilityA1

Method for Modifying and Controlling the Threshold Voltage of Thin Film Transistors

Assignee: THIN FILM ELECTRONICS ASAPriority: Jan 21, 2008Filed: Mar 27, 2017Published: Jul 13, 2017
Est. expiryJan 21, 2028(~1.5 yrs left)· nominal 20-yr term from priority
H10P 14/3802H10P 14/3451H10P 14/3444H10P 14/3442H10P 14/265H10P 14/3411C09D 11/52C08K 2201/001C09D 183/16C08K 5/55C08G 77/56H01L 21/02667H01L 21/02532H01L 21/02576H01L 21/02579H01L 21/02628H01L 29/167H01L 29/66757H10D 86/0241H10D 62/834H10D 30/0321H10D 30/0314
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Claims

Abstract

Doped semiconductor ink formulations, methods of making doped semiconductor ink formulations, methods of coating or printing thin films, methods of forming electronic devices and/or structures from the thin films, and methods for modifying and controlling the threshold voltage of a thin film transistor using the films are disclosed. A desired dopant may be added to an ink formulation comprising a Group IVA compound and a solvent, and then the ink may be printed on a substrate to form thin films and conductive structures/devices, such as thin film transistors. By adding a customized amount of the dopant to the ink prior to printing, the threshold voltage of a thin film transistor made from the doped semiconductor ink may be independently controlled upon activation of the dopant.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A thin film transistor, capacitor, diode, resistor device, circuit, RFID tag, display backplane, sensor and/or photovoltaic device, comprising a semiconductor film having 0.1 to 50 ppm of dopant atoms therein. 
     
     
         2 . The device of  claim 1 , wherein the semiconductor film comprises a printed doped silicon film on a substrate. 
     
     
         3 . The device of  claim 2 , wherein the dopant atoms comprise B, P, As, or Sb. 
     
     
         4 . The device of  claim 1 , wherein the semiconductor film comprises 1-10 ppm of dopant atoms therein. 
     
     
         5 . The device of  claim 4 , wherein the device is a thin film transistor. 
     
     
         6 . The device of  claim 4 , wherein the dopant atoms are present in an amount sufficient to control a threshold voltage of the thin film transistor. 
     
     
         7 . The device of  claim 2 , further comprising a conductor on the printed doped silicon film. 
     
     
         8 . A method of controlling a threshold voltage of a thin film transistor comprising:
 a) making a semiconductor ink comprising a Group IVA compound containing at least five Si and/or Ge atoms, a dopant in an amount effective to provide a film with a dopant atom concentration of from 0.1 to 50 ppm, relative to the number of Group IVA atoms, and a solvent;   b) forming a film from the ink; and   c) activating the dopant in the film.   
     
     
         9 . The method of  claim 8 , wherein forming the film comprises:
 a) printing the semiconductor ink by inkjetting, gravure printing, off-set lithography, screen printing, flexographic printing, microspotting, pen-coating, syringe dispensing, spray jetting, and/or pump dispensing;   b) heating the printed ink to form a doped semiconductor; and   c) annealing and/or irradiating the doped semiconductor sufficiently to at least partially crystallize, reduce a hydrogen content of, and/or electrically activate the dopant in the doped semiconductor and form the doped semiconductor film.   
     
     
         10 . The method of  claim 9 , wherein said ink is printed in a pattern corresponding to the thin film transistor. 
     
     
         11 . The method of  claim 9 , further comprising irradiating the composition with UV radiation, simultaneously with or immediately subsequent to printing the composition onto the substrate. 
     
     
         12 . The method of  claim 8 , wherein forming the film comprises:
 a) blanket depositing the ink;   b) heating the blanket deposited ink to form a doped semiconductor;   c) annealing and/or irradiating the doped semiconductor sufficiently to at least partially crystallize, reduce a hydrogen content of, and/or electrically activate the dopant in the doped semiconductor and form the doped semiconductor film; and   d) patterning the doped semiconductor or the doped semiconductor film by photolithography and/or etching processes.   
     
     
         13 . The method of  claim 12 , further comprising irradiating the composition with UV radiation, simultaneously with or immediately subsequent to blanket-depositing the composition onto the substrate. 
     
     
         14 . The method of  claim 8 , wherein the Group IVA compound comprises a polysilane having at least 15 Si and/or Ge atoms, and the solvent is selected from the group consisting of linear alkanes, cycloalkanes, arenes, fluoroalkanes, and siloxanes. 
     
     
         15 . The method of  claim 8 , wherein the dopant comprises an organoborane, a hydroborane, a haloborane, or a borane complex. 
     
     
         16 . The method of  claim 15 , wherein the organoborane has the formula BR 3  or B 2 R 6 , where each R is independently selected from the group consisting of C 1 -C 10  alkyl, C 6 -C 10  aryl, C 6 -C 10  aryl substituted with 1 to 3 C 1 -C 4  alkyl groups, C 7 -C 12  aralkyl, halogen, hydrogen, GeR′ 3 , SiR′ 3  and Si x H 2x+1 , where R′ is independently hydrogen, halogen, C 1 -C 10  alkyl, C 6 -C 10  aryl, C 6 -C 10  aryl substituted with 1 to 3 C 1 -C 4  alkyl groups, C 7 -C 12  aralkyl, or Si x H 2x+1 , and x is an integer of from 1 to 4, such that the combined R and/or R′ groups include at least 6 carbon atoms per boron atom. 
     
     
         17 . The method of  claim 8 , wherein the dopant comprises elemental phosphorus, a phosphane, an arsane, a stibane, an organophosphine, an organophosphine oxide, an organophosphite, an organophosphoramide, organophosphate, an organoarsine and/or an organostibine. 
     
     
         18 . The method of  claim 17 , wherein the organophosphine has the formula PR 3 , where each R is independently selected from the group consisting of C 1 -C 10  alkyl, C 6 -C 10  aryl, C 6 -C 10  aryl substituted with 1 to 3 C 1 -C 4  alkyl groups, C 7 -C 12  aralkyl, halogen, hydrogen, GeR′ 3 , SiR′ 3  and Si x H 2x+1 , where R′ is independently hydrogen, halogen, C 1 -C 10  alkyl, C 6 -C 10  aryl, C 6 -C 10  aryl substituted with 1 to 3 C 1 -C 4  alkyl groups, C 7 -C 12  aralkyl, or Si x H 2x+1 , and x is an integer of from 1 to 4, such that the combined R and/or R′ groups include at least 6 carbon atoms per phosphorous atom. 
     
     
         19 . The method of  claim 8 , wherein the dopant has a boiling point greater than 150° C. 
     
     
         20 . The method of  claim 8 , wherein the dopant is present in an amount sufficient to provide a film with a dopant atom concentration of from 1 to 10 ppm, relative to Group IVA atoms.

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