Sidewall-connected hvac units for modular datacenter facilities

Abstract

A modular datacenter facility and a method thereof is provided in accordance with some embodiments. The module datacenter facility can be constructed with an initial set of building modules of different types of functionality. A first building module can be a data-floor building module. A first set of sidewall-connected heating, ventilation, and air conditioning (“HVAC”) units can connect to a sidewall of the modular datacenter facility and use electrical power provided by a first electrical power distribution building module to supply conditioned air into an air-supply plenum of the sidewall to cool computing systems housed in the data-floor building module. The first set of the sidewall-connected HVAC units allow for fewer penetrations in a roof of the data-floor building module, thereby minimizing an amount of leaks potentially occurring in the roof of the ceiling, and thereby minimizing risk of any damage to the computing systems.

What is claimed is: 
     
         1 . An apparatus, comprising:
 a modular datacenter facility constructed with at least an initial set of building modules of different types of functionality to form the modular datacenter facility,
 wherein each type of building module in the set has a specific collection of functionality associated with that type of building module, 
 wherein each building module of the set is a pre-engineered, standardized building block having a standardized, pre-approved architectural design and layout, 
 wherein a first type of building module in the modular datacenter facility is a data-floor building module that is pre-engineered and has the pre-approved architectural design and layout to house computing systems, 
 wherein the computing systems include servers and storage devices housed in hot and cool zones of the data-floor building module and routers and switches to transport data traffic between the servers as well as transport traffic to a world exterior to the modular datacenter facility, 
 wherein a first set of sidewall-connected heating, ventilation, and air conditioning (“HVAC”) units for the data-floor building module connect to a sidewall of the modular datacenter facility and use electrical power provided by a first electrical power distribution building module to supply conditioned air into an air-supply plenum of the sidewall, which can be a sidewall of the data-floor building module or a service corridor, in order to cool the computing systems including the servers, storage devices, routers, and switches, and other electronic components housed in the data-floor building module of the modular datacenter facility, 
 wherein the first set of the sidewall-connected HVAC units allow for cooling of the computing systems and the other electronic components allowing for more server units to consume electrical power during their operation inside the data-floor building module without raising a temperature in the data-floor building module high enough to overheat the computing systems and the other electronic components, 
 wherein the first set of the sidewall-connected HVAC units connecting to the sidewall allow for fewer penetrations in a roof of the data-floor building module, thereby minimizing an amount of leaks potentially occurring in the roof of the ceiling, and thereby minimizing risk of any damage to the computing systems and the other electronic components housed in the data-floor building module from the leaks, and 
 wherein the roof includes a vapor-to-air sealant layer on top of a concrete layer to further prevent leaks from potentially occurring in the data-floor building module from in through the roof. 
   
     
     
         2 . The apparatus of  claim 1 ,
 wherein an air channel, including any of a duct, a plenum, and a combination of one or more ducts and plenums, begins an air-flow path of the conditioned air at the first set of the sidewall-connected HVAC units, through the air-supply plenum of the sidewall, through an under-floor plenum positioned under a raised floor of the data-floor building module, through the raised floor of the data-floor building module, through one or more perforated tiles covering the raised floor, and into an interior of the data-floor building module for the cooling of the computing systems and the other electronic components housed in the data-floor building module.   
     
     
         3 . The apparatus of  claim 2 ,
 wherein the air channel air-flow path of the conditioned air continues from the interior of the data-floor building module, through a ceiling of the of the data-floor building module, where one or more return ducts above the ceiling route heated air from above the data-floor building module down along the sidewall and back to an air intake of the first set of the sidewall-connected HVAC units, and   wherein the first set of the sidewall-connected HVAC units remove heat from the heated air to provide the conditioned air for recirculation of the conditioned air through the air channel, including through the air-supply plenum of the sidewall, through the under-floor plenum, and through the raised floor of the data-floor building module for the cooling of the computing systems and the other electronic components.   
     
     
         4 . The apparatus of  claim 1 ,
 wherein the first set of the sidewall-connected HVAC units are configured with heat exchangers to remove heat from recirculating conditioned air inside the data-floor building module without introducing air from outside the data-floor building module, thereby preventing outside air with humidity and potential pollution from mixing with the recirculating conditioned air inside the data-floor building module, and thereby minimizing damage to the computing systems and the other electronic components housed in the data-floor building module, and   wherein the first set of the sidewall-connected HVAC units use the heat exchangers rather than louvers to remove the heat from the recirculating conditioned air supplied to the air channel from inside the data-floor building module.   
     
     
         5 . The apparatus of  claim 4 ,
 wherein the first set of the sidewall-connected HVAC units configured with the heat exchangers are further configured to work with at least one other HVAC unit that brings in the outside air as makeup air to make up for losses in the recirculated conditioned air, and   wherein the at least one other HVAC unit includes a humidity-control system and a pollution-control system configured to control the humidity and the potential pollution of the makeup air that enters the modular datacenter facility for the losses in the recirculated conditioned air.   
     
     
         6 . The apparatus of  claim 1 ,
 wherein the initial set of the building modules form the modular datacenter facility upon a parcel of land, and, when a need of space and additional capacity of the modular datacenter facility develops, then an additional one or more sets of the building modules of the different types are rapidly added to the initial set of the building modules, thereby transforming the modular datacenter facility by a step-by-step approach carried out over time by addition of the additional one or more sets of the building modules of the different types,   wherein one or more connecting corridors are architected into the building modules of the different types, and   wherein corresponding aligned doorways between the building modules of the different types interconnect at least two building modules adjacent and abutted to each other.   
     
     
         7 . The apparatus of  claim 1 ,
 wherein the air-supply plenum and an air-return plenum of the sidewall of the modular datacenter facility are constructed with the pre-approved architectural design and layout to add additional sidewall-connected HVAC units at a later date from initial construction of the modular datacenter facility with the initial set of building modules of the different types of functionality, and   wherein the first set of the sidewall-connected HVAC units are configured to allow the first set of the sidewall-connected HVAC units to be installed during a first time period of the data-floor building module to cool the computing systems and the other electronic components housed in the data-floor building module during the first time period, and then, at a second, later time period of the data-floor building module, the first set of the sidewall-connected HVAC units are configured to allow a second set of the sidewall-connected HVAC units to be proximately installed and connected into the air-supply plenum and the air-return plenum of the sidewall to cool the computing systems and the other electronic components housed in the data-floor building module during the second time period of the data-floor building module.   
     
     
         8 . The apparatus of  claim 7 ,
 wherein the second set of the sidewall-connected HVAC units are installed with the pre-approved architectural design and layout selected from the group consisting of
 i) horizontally along the sidewall of the modular datacenter facility in line with the first set of the sidewall-connected HVAC units, 
 ii) vertically up the sidewall of the modular datacenter facility in a configuration on top of the first set of the sidewall-connected HVAC units, 
 iii) or a combination of horizontally along the sidewall of the modular datacenter facility and vertically up the sidewall of the modular datacenter facility in the configuration on top of the first set of sidewall-connected HVAC units, 
   wherein the second set of sidewall-connected HVAC units are powered by a second electrical power distribution building module in order to allow an increase in power and cooling capability over time for the data-floor building module, and   wherein the sidewall of the modular datacenter facility is constructed with the pre-approved architectural design and layout to add the second electrical power distribution module with electrical conduits and trays routed through the sidewall during the second time period of the data-floor building module.   
     
     
         9 . The apparatus of  claim 1 ,
 wherein a data-hall building module of the initial set of the building modules includes a steel-based joist or concrete beam that horizontally connects two parallel sections of wall of the data-hall building module to eliminate a need for support columns on a raised floor of the data-hall building module for supporting the computing systems and the other electronic components,   wherein the steel-based joist or concrete beam ensures that users of the data-floor building module have a sufficient degree of flexibility to accommodate a number of server-rack configurations for racks of the servers having varying power consumption densities in the hot and the cool zones of the data-hall building module, and   wherein the raised floor houses the computing systems and other electronic components as well as creates a single, under-floor plenum configured for supplying the conditioned air under the raised floor to an interior of the data-hall building module and returning heated air to a return plenum or return ducts in a ceiling above the data-floor building module for return of the heated air to the first set of sidewall-connected HVAC units.   
     
     
         10 . The apparatus of  claim 9 ,
 wherein a service corridor and a personnel corridor run a length of at least some of the initial set of building modules connected in the modular datacenter facility,   wherein a hardened-structure building module of the initial set of building modules includes a hardened shell and one or more service or personnel corridors between a first instance of the hardened-structure building module and a second instance of the hardened-structure building module connect to and abutting the first instance of the hardened-structure building module,   wherein the one or more service or personnel corridors are laid out between an interior wall and an exterior wall of the hardened-structure building module forming the hardened shell of the hardened-structure building module, and   wherein the roof further includes an insulation layer and a cover-board layer on top of the vapor-to-air sealant layer.   
     
     
         11 . A method, comprising:
 constructing a modular datacenter facility with at least an initial set of building modules of different types of functionality to form the modular datacenter facility,
 wherein each type of building module in the set has a specific collection of functionality associated with that type of building module, 
 wherein each building module of the set is a pre-engineered, standardized building block having a standardized, pre-approved architectural design and layout, and 
 wherein a first type of building module in the modular datacenter facility is a data-floor building module that is pre-engineered and has the pre-approved architectural design and layout to house computing systems; 
   housing, in hot and cool zones of the data-floor building module, the computing systems including servers and storage devices, as well as routers and switches, to transport data traffic between the servers and a world exterior to the modular datacenter facility;   connecting a first set of sidewall-connected heating, ventilation, and air conditioning (“HVAC”) units for the data-floor building module to a sidewall of the modular datacenter facility and using electrical power provided by a first electrical power distribution building module to supply conditioned air into an air-supply plenum of the sidewall, which can be a sidewall of the data-floor building module or a service corridor, in order to cool the computing systems including the servers, storage devices, routers, and switches, and other electronic components housed in the data-floor building module of the modular datacenter facility,
 wherein the first set of the sidewall-connected HVAC units allow for cooling of the computing systems and the other electronic components allowing for more server units to consume electrical power during their operation inside the data-floor building module without raising a temperature in the data-floor building module high enough to overheat the computing systems and the other electronic components, and 
 wherein the first set of the sidewall-connected HVAC connecting to the sidewall units allow for fewer penetrations in a roof of the data-floor building module, thereby minimizing an amount of leaks potentially occurring in the roof of the ceiling, and thereby minimizing risk of any damage to the computing systems and the other electronic components housed in the data-floor building module from the leaks; and 
   sealing the roof with a vapor-to-air sealant layer on top of a concrete layer to further prevent leaks from potentially occurring in the data-floor building module from in through the roof.   
     
     
         12 . The method of  claim 11 , further comprising:
 constructing an air channel, including any of a duct, a plenum, and a combination of one or more ducts and plenums for an air-flow path for the conditioned air beginning at the first set of the sidewall-connected HVAC units, through the air-supply plenum of the sidewall, through an under-floor plenum positioned under a raised floor of the data-floor building module, through the raised floor of the data-floor building module, through one or more perforated tiles covering the raised floor, and into an interior of the data-floor building module for the cooling of the computing systems and the other electronic components housed in the data floor building module.   
     
     
         13 . The method of  claim 12 , further comprising:
 constructing the air channel for the air-flow path of the conditioned air to continue from the interior of the data-floor building module, through a ceiling of the of the data-floor building module, where one or more return ducts above the ceiling route heated air from above the data-floor building module down along the sidewall and back to an air intake of the first set of the sidewall-connected HVAC units,
 wherein the first set of the sidewall-connected HVAC units remove heat from the heated air to provide the conditioned air for recirculation of the conditioned air through the air channel, including through the air-supply plenum of the sidewall, through the under-floor plenum, and through the raised floor of the data-floor building module for the cooling of the computing systems and the other electronic components. 
   
     
     
         14 . The method of  claim 11 , further comprising:
 configuring the first set of the sidewall-connected HVAC units with heat exchangers to remove heat from recirculating conditioned air inside the data-floor building module without introducing air from outside the data-floor building module, thereby preventing outside air with humidity and potential pollution from mixing with the recirculating conditioned air inside the data-floor building module, and thereby minimizing damage to the computing systems and the other electronic components housed in the data-floor building module,
 wherein the first set of the sidewall-connected HVAC units use the heat exchangers rather than louvers to remove the heat from the recirculating conditioned air supplied to the air channel from inside the data-floor building module. 
   
     
     
         15 . The method of  claim 14 , further comprising:
 configuring the first set of the sidewall-connected HVAC units with the heat exchangers to work with at least one other HVAC unit that brings in the outside air as makeup air to make up for losses in the recirculated conditioned air,
 wherein at least one other HVAC unit includes a humidity-control system and a pollution-control system configured to control the humidity and the potential pollution of the makeup air that enters the modular datacenter facility the losses in the recirculated conditioned air. 
   
     
     
         16 . The method of  claim 11 , further comprising:
 adding an additional one or more sets of the building modules of the different types to the initial set of the building modules upon a parcel of land when a need of space and additional capacity of the modular datacenter facility develops, thereby transforming the modular datacenter facility by a step-by-step approach carried out over time by addition of the additional one or more sets of the building modules of the different types;   architecting one or more connecting corridors into the building modules of the different types; and   aligning doorways between the building modules of the different types interconnecting at least two building modules adjacent and abutted to each other.   
     
     
         17 . The method of  claim 11 , further comprising:
 constructing the air supply plenum and an air return channel of the sidewall of the modular datacenter facility,
 wherein the air-supply plenum and the air-return plenum of the sidewall of the modular datacenter facility have the pre-approved architectural design and layout for adding additional sidewall-connected HVAC units at a later date from initial construction of the modular datacenter facility with the initial set of building modules of the different types of functionality, and 
   configuring the first set of the sidewall-connected HVAC units to allow the first set of the sidewall-connected HVAC units to be installed during a first time period of the data-floor building module to cool the computing systems and the other electronic components housed in the data-floor building module during the first time period, and then, at a second, later time period of the data-floor building module, configuring the first set of the sidewall-connected HVAC units to allow a second set of the sidewall-connected HVAC units to be proximately installed and connected into the air-supply plenum and the air-return plenum of the sidewall to cool the computing systems and the other electronic components housed in the data-floor building module during the second time period of the data-floor building module.   
     
     
         18 . The method of  claim 17 , further comprising:
 installing the second set of the sidewall-connected HVAC units with the pre-approved architectural design and layout selected from the group consisting of
 i) horizontally along the sidewall of the modular datacenter facility in line with the first set of the sidewall-connected HVAC units, 
 ii) vertically up the sidewall of the modular datacenter facility in a configuration on top of the first set of the sidewall-connected HVAC units, or 
 iii) in a combination of horizontally along the sidewall of the modular datacenter facility and vertically up the sidewall of the modular datacenter facility in the configuration on top of the first set of sidewall-connected HVAC units; and 
   powering the second set of sidewall-connected HVAC units by a second electrical power distribution building module in order to allow an increase in power and cooling capability over time for the data-floor building module,
 wherein the sidewall of the modular datacenter facility is constructed with the pre-approved architectural design and layout to add the second electrical power distribution module with electrical conduits and trays routed through the sidewall during the second time period of the data-floor building module. 
   
     
     
         19 . The method of  claim 11 , further comprising:
 horizontally connecting two parallel sections of wall of a data-hall building module of the initial set of the building modules with a steel-based joist or concrete beam to eliminate a need for support columns on a raised floor of the data-hall building module to support the computing systems and the other electronic components,
 wherein the steel-based joist or concrete beam ensures that users of the data-floor building module have a sufficient degree of flexibility to accommodate a number of server-rack configurations for racks of the servers having varying power consumption densities in the hot and the cool zones of the data-hall building module, and 
 wherein the raised floor houses the computing systems and other electronic components as well as creates a single, under-floor plenum configured for supplying the conditioned air under the raised floor to an interior of the data-hall building module and returning heated air to a return plenum or return ducts in a ceiling above the data-floor building module for return of the heated air to the first set of sidewall-connected HVAC units. 
   
     
     
         20 . The method of  claim 19 , further comprising:
 constructing a service corridor and a personnel corridor along a length of at least some of the initial set of building modules connected in the modular datacenter facility,
 wherein a hardened-structure building module of the initial set of building modules includes a hardened shell and one or more service or personnel corridors between a first instance of the hardened-structure building module and a second instance of the hardened-structure building module connect to and abutting the first instance of the hardened-structure building module, and 
 wherein the one or more service or personnel corridors are laid out between an interior wall and an exterior wall of the hardened-structure building module forming the hardened shell of the hardened-structure building module, 
 wherein the roof further includes an insulation layer and a cover-board layer on top of the vapor-to-air sealant layer.