Testing of electronic devices through capacitive interface

Abstract

A test apparatus includes test probes for exchanging electrical signals with terminals of an electronic device under test. The test probes form a capacitive electromagnetic coupling connection with the terminals.

1 . An apparatus for probing, comprising at least one probe tip, wherein each probe tip comprises:
 a conductive probe body configured to carry an integrated circuit testing signal; and   a non-conductive probe end having a concave surface structured to engage a conductive contact of an integrated circuit;   wherein the conductive probe body and conductive contact form a capacitive coupling for transmission of the integrated circuit testing signal.   
     
     
         2 . The apparatus for probing of  claim 1 , wherein an end of the conductive probe body has a concave surface and the non-conductive probe end is a layer of non-conductive material attached to the concave surface of the conductive probe body. 
     
     
         3 . The apparatus for probing of  claim 2 , wherein the concave surface of the non-conductive probe end is shaped to engage the contact having a spherical cross-sectional shape. 
     
     
         4 . The apparatus for probing of  claim 2 , wherein the concave surface of the non-conductive probe end is shaped to engage the contact having a rectangular or square cross-sectional shape. 
     
     
         5 . The apparatus for probing of  claim 1 , wherein the concave surface of the non-conductive probe end is configured to control a stable capacitance of the capacitive coupling. 
     
     
         6 . The apparatus for probing of  claim 1 , wherein said at least one probe tip comprises a plurality of probe tips, and wherein the concave surface of the non-conductive probe end for the plurality of probe tips is configured to control a uniform capacitance of the capacitive coupling across the plurality of probe tips. 
     
     
         7 . The apparatus for probing of  claim 1 , wherein an end of the conductive probe body has a concave surface, wherein the non-conductive probe end is a layer of non-conductive material attached to the concave surface of the conductive probe body, and wherein a portion of the end of the conductive probe body having the concave surface is configured to make contact with a surface of the integrated circuit. 
     
     
         8 . The apparatus for probing of  claim 7 , wherein said surface of the integrated circuit is a surface of a passivation layer. 
     
     
         9 . The apparatus for probing of  claim 1 , wherein the non-conductive probe end is made of an elastic material. 
     
     
         10 . The apparatus for probing of  claim 1 , further comprising an inductor connected in series with the conductive probe body, said inductor and capacitive coupling forming a resonant LC circuit. 
     
     
         11 . The apparatus for probing of  claim 10 , wherein said integrated circuit testing signal is communicated at a frequency substantially corresponding to a resonance frequency of the resonant LC circuit.