Discrete flexible interconnects for modules of integrated circuits

Abstract

Flexible interconnects, flexible integrated circuit systems and devices, and methods of making and using flexible integrated circuitry are presented herein. A flexible integrated circuit system is disclosed which includes first and second discrete devices that are electrically connected by a discrete flexible interconnect. The first discrete devices includes a first flexible multi-layer integrated circuit (IC) package with a first electrical connection pad on an outer surface thereof. The second discrete device includes a second flexible multi-layer integrated circuit (IC) package with a second electrical connection pad on an outer surface thereof. The discrete flexible interconnect is attached to and electrically connects the first electrical connection pad of the first discrete device to the second electrical connection pad of the second discrete device.

1 .- 20 . (canceled) 
     
     
         21 . A flexible integrated circuit system comprising:
 a first discrete device with a first integrated circuit (IC) package including a first outer surface with a first electrical connection pad;   a second discrete device with a second integrated circuit (IC) package including a second outer surface with a second electrical connection pad, at least one of the first IC package and the second IC package comprising a sensor device; and   a discrete flexible interconnect attached to and electrically connecting the first electrical connection pad of the first discrete device to the second electrical connection pad of the second discrete device.   
     
     
         22 . The flexible integrated circuit system of claim  1 , wherein the sensor device comprises at least one of a physical sensor, a biological sensor, a chemical sensor, an optical sensor, or any combination thereof. 
     
     
         23 . The flexible integrated circuit system of  claim 22 , wherein the sensor device comprises the at least one physical sensor, and the at least one physical sensor includes a temperature sensor, a pH sensor, a radiation sensor, a tactile sensor, an acoustic sensor, or any combination thereof. 
     
     
         24 . The flexible integrated circuit system of  claim 23 , wherein the temperature sensor includes a thermocouple, a silicon band gap temperature sensor, a thin-film resistance temperature device, or any combination thereof. 
     
     
         25 . The flexible integrated circuit system of  claim 23 , wherein the at least one optical sensor includes a light-emitting diode (LED) emitter, a photodetector, an infrared sensor, or any combination thereof. 
     
     
         26 . The flexible integrated circuit system of  claim 22 , wherein the sensor device comprises the at least one biological sensor, the at least one biological sensor being configured to detect an electrochemical parameter, a biochemical parameter, or any combination thereof. 
     
     
         27 . The flexible integrated circuit system of  claim 26 , wherein at least one of the electrochemical parameter and the biochemical parameter is a pH level, an enzymatic activity, a blood glucose component, a protein concentration, or any combination thereof. 
     
     
         28 . The flexible integrated circuit system of claim  1 , wherein the sensor device is coupled to at least one of an amplifier, a buffer, an A/D converter, a D/A converter, an electro-mechanical transducer, a piezo-electric actuator, or any combination thereof. 
     
     
         29 . The flexible integrated circuit system of claim  1 , wherein at least one of the first IC package, and the second IC package comprises a sensor hub configured to integrate and process data signals from the sensor device. 
     
     
         30 . The flexible integrated circuit system of  claim 29 , wherein the sensor hub comprises a microcontroller, a digital signal processor (DSP), an amplifier circuit, a logic circuit, a microchip, or any combination thereof. 
     
     
         31 . The flexible integrated circuit system of  claim 29 , wherein the first IC package comprises a first sensor device and a first microchip and the second IC package comprises a second sensor device and a second microchip. 
     
     
         32 . The flexible integrated circuit system of  claim 29 , further comprising a power source configured to supply power to the sensor device and/or the sensor hub. 
     
     
         33 . The flexible integrated circuit system of claim  1 , wherein at least one of the first IC package and the second IC package comprises one or more integrated passive devices. 
     
     
         34 . The flexible integrated circuit system of claim  1 , wherein the one or more integrated passive devices includes a filter, a transformer, a photodiode, an LED, an electrode, a semiconductor, a duplexer, a coupler, a phase shifter, a thin-film device, a circuit element, an control element, a capacitor, a resistor, an inductor, a buffer, or any combination thereof. 
     
     
         35 . The flexible integrated circuit system of claim  1 , wherein at least one of the first IC package and the second IC package comprises an RF antenna configured to wirelessly communicate with an external device. 
     
     
         36 . The flexible integrated circuit system of claim  1 , wherein at least one of the first IC package and the second IC package is a flexible IC package. 
     
     
         37 . The flexible integrated circuit system of claim  1 , wherein at least one of the first IC package and the second IC package is a multi-layer IC package. 
     
     
         38 . The flexible integrated circuit system of claim  1 , wherein the first IC package comprises a first sensor device embedded in or on a first flexible polymeric substrate, and the second IC package comprises a second sensor device embedded in or on a second flexible polymeric substrate. 
     
     
         39 . The flexible integrated circuit system of  claim 38 , wherein the first IC package comprises a first adhesive layer on the first flexible polymeric substrate, and the second IC package comprises a second adhesive layer on the second flexible polymeric substrate. 
     
     
         40 . The flexible integrated circuit system of  claim 39 , wherein the first IC package further comprises a first conductive layer coupled via the first adhesive layer to the first flexible polymeric substrate, and the second IC package further comprises a second conductive layer coupled via the second adhesive layer to the second flexible polymeric substrate.