Medical tablet, and manufacturing method and manufacturing apparatus for medical tablet

Abstract

An object is to provide a tablet manufacturing apparatus capable of supplying an IC chip to a desired position of pharmaceutical powder with a high accuracy and suppressing a positional displacement. The IC chip is supported by a positioning guide with a chip main body in a downward manner, and is held in a state of being positioned above pharmaceutical powder filled in a die hole before compression. The IC chip is supplied by a pusher.

1 . An apparatus, comprising:
 a medical tablet including an integrated circuit (IC) chip member equipped with an IC therein, said medical tablet having a first surface and a second surface opposite the first surface, wherein   an engraved stamp or cleavage line is formed in said first surface,   an engraved stamp or cleavage line is not formed or an engraved stamp or cleavage line shallower than that in said first surface is formed in said second surface, and said IC chip member has a base plane and a convex portion protruding more on one side than on the other side with respect to said base plane, and the convex portion is arranged within the medical tablet to face the second surface.   
     
     
         2 . The apparatus of  claim 1 , wherein the engraved stamp or cleavage line formed in said first surface is formed in an upper pestle of a tableting machine. 
     
     
         3 . The apparatus of  claim 1 , wherein the IC chip member is configured to be supplied on pharmaceutical powder in a die hole by a supply portion, the IC chip member is configured to be held in a downward manner by the supply portion such that the convex portion faces downward when said supply portion supplies the IC chip member on the pharmaceutical powder. 
     
     
         4 . The apparatus of  claim 1 , wherein the IC chip member is configured to be held by a carrier tape having an accommodation portion in an upward manner where the convex portion faces upward,
 the IC chip member in the upward manner is configured to be removed from the accommodation portion, reversed upside down and changed to said downward manner, prior to being supplied onto pharmaceutical powder.   
     
     
         5 . The apparatus of  claim 1 , wherein the medical tablet includes first pharmaceutical powder and second pharmaceutical powder, the IC chip member is configured to be supplied onto the first pharmaceutical powder in a downward manner such that the convex portion faces downward and contacts the first pharmaceutical powder prior to the second pharmaceutical powder being supplied onto the IC chip member. 
     
     
         6 . The apparatus of  claim 1 , wherein the IC chip member is configured to be compressed between first pharmaceutical powder and second pharmaceutical powder by a set of pestles. 
     
     
         7 . The apparatus of  claim 1 , wherein the IC chip member is configured to be held within a through-hole defined by a positioning guide and having a plurality of protrusions protruding toward a center of the through-hole to hold the IC chip member in a downward manner where the convex portion faces downward, the IC chip member configured to be pushed out of the positioning guide and onto first pharmaceutical powder filled in a die hold such that second pharmaceutical powder can be filled onto the IC chip member to define the medical tablet.