High-frequency module and microwave transceiver

Abstract

A high-frequency module according to an embodiment includes a first board, a first device, a second board, a metal core, and a casing. The first board is formed with an opening, and has a surface at a first side on which a transmission circuit transmitting microwaves is formed. The first device is disposed in the opening of the first board. The second substrate is disposed at a second side of the first board. The second substrate is formed with a control circuit for the first device, and has an opening at a location overlapping the first device. The metal core is disposed between the first board and the second board, and is in contact with the first device. The casing includes a connection connected with the metal core via an opening formed in the second board.

What is claimed is: 
     
         1 . A high-frequency module characterized by comprising a device, the high-frequency module further comprising:
 a first board in which an opening is formed, and which includes a transmission circuit formed on a surface at a first side, the transmission circuit transmits a microwave;   a first device disposed in the opening of the first board;   a second board which is disposed at a second side of the first board, and which is formed with a control circuit for the first device, and in which an opening is formed at a location overlapping the first device;   a metal core which is disposed between the first board and the second board, and which is in contact with the first device; and   a casing which is formed of a metal, and which includes a connection connected with the metal core via the opening of the second board.