Multilayer ceramic electronic part and method of manufacturing the same

Abstract

A multilayer ceramic electronic part includes a body portion including an internal electrode and a dielectric layer, a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode, and a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin. The second conductivity-type metal has a melting point lower than a curing temperature of the base resin.

What is claimed is: 
     
         1 . A multilayer ceramic electronic part comprising:
 a body portion including an internal electrode and a dielectric layer;   a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode; and   a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin,   wherein the second conductivity-type metal has a melting point lower than a curing temperature of the base resin.   
     
     
         2 . The multilayer ceramic electronic part of  claim 1 , wherein the base resin is a thermosetting resin. 
     
     
         3 . The multilayer ceramic electronic part of  claim 1 , wherein the second conductivity-type metal encompasses the first conductivity-type metal particle. 
     
     
         4 . The multilayer ceramic electronic part of  claim 1 , wherein the second conductivity-type metal has the melting point of 300° C. or lower. 
     
     
         5 . The multilayer ceramic electronic part of  claim 1 , wherein the first conductivity-type metal particle and the second conductivity-type metal contact each other. 
     
     
         6 . The multilayer ceramic electronic part of  claim 1 , wherein the first conductivity-type metal particle contains one or more of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof. 
     
     
         7 . The multilayer ceramic electronic part of  claim 1 , wherein the second conductivity-type metal is formed of an alloy of two or more selected from tin (Sn), lead (Pb), indium (In), copper (Cu), silver (Ag), and bismuth (Bi). 
     
     
         8 . The multilayer ceramic electronic part of  claim 1 , further comprising a second electrode layer disposed on the conductive resin layer. 
     
     
         9 . The multilayer ceramic electronic part of  claim 8 , wherein the second electrode layer is a plating layer. 
     
     
         10 . The multilayer ceramic electronic part of  claim 9 , wherein the second electrode includes a nickel plating layer and a tin plating layer. 
     
     
         11 . The multilayer ceramic electronic part of  claim 1 , wherein the first conductivity-type metal particle has a melting point higher than the curing temperature of the base resin. 
     
     
         12 . A method of manufacturing a multilayer ceramic electronic part, comprising:
 forming a body portion including a dielectric layer and an internal electrode;   forming a first electrode layer on an end surface of the body portion to be electrically connected to an end of the internal electrode;   applying a conductive resin composition including a first conductivity-type metal particle, a thermosetting resin, and a second conductivity-type metal having a melting point lower than a curing temperature of the thermosetting resin, onto the first electrode layer; and   converting the conductive resin composition to a conductive resin layer in such a manner that the second conductivity-type metal having melted during curing of the thermosetting resin encompasses the first conductivity-type metal particle.   
     
     
         13 . The method of  claim 12 , wherein the second conductivity-type metal has the melting point of 300° C. or lower. 
     
     
         14 . The method of  claim 12 , wherein the first conductivity-type metal particle and the second conductivity-type metal in a molten state are in direct contact with each other. 
     
     
         15 . The method of  claim 12 , wherein the first conductivity-type metal particle contains one or more of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof. 
     
     
         16 . The method of  claim 12 , wherein the second conductivity-type metal is formed of an alloy of two or more selected from tin (Sn), lead (Pb), indium (In), copper (Cu), silver (Ag), and bismuth (Bi). 
     
     
         17 . The method of  claim 12 , further comprising forming a second electrode layer on the conductive resin layer. 
     
     
         18 . The method of  claim 17 , wherein the second electrode layer is formed through plating. 
     
     
         19 . The method of  claim 12 , wherein the first conductivity-type metal particle has a melting point higher than the curing temperature of the thermosetting resin. 
     
     
         20 . The method of  claim 12 , wherein the first electrode layer is formed by sintering a paste including a conductive metal and glass. 
     
     
         21 . A multilayer ceramic electronic part comprising:
 a body portion including an internal electrode and a dielectric layer;   a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode; and   a conductive resin layer disposed on the first electrode layer, and including a base resin, a plurality of first conductivity-type metal particles dispersed among the base resin, and a second conductivity-type metal encompassing two or more of the plurality of first conductivity-type metal particles.   
     
     
         22 . The multilayer ceramic electronic part of  claim 21 , wherein the two or more of the plurality of first conductivity-type metal particles encompassed by the second conductivity-type metal are electrically connected to each other by the second conductivity-type metal. 
     
     
         23 . The multilayer ceramic electronic part of  claim 21 , wherein one of the plurality of first conductivity-type metal particles not encompassed by the second conductivity-type metal directly contacts the second conductivity-type metal. 
     
     
         24 . The multilayer ceramic electronic part of  claim 21 , wherein a curing temperature of the base resin is higher than a melting point of the second conductivity-type metal and is lower than a melting point of the plurality of first conductivity-type metal particles. 
     
     
         25 . The multilayer ceramic electronic part of  claim 21 , wherein the base resin is a thermosetting resin. 
     
     
         26 . The multilayer ceramic electronic part of  claim 21 , wherein the second conductivity-type metal has a melting point of 300° C. or lower. 
     
     
         27 . The multilayer ceramic electronic part of  claim 21 , wherein the plurality of first conductivity-type metal particles contain one or more of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof. 
     
     
         28 . The multilayer ceramic electronic part of  claim 21 , wherein the second conductivity-type metal is formed of an alloy of two or more selected from tin (Sn), lead (Pb), indium (In), copper (Cu), silver (Ag), and bismuth (Bi). 
     
     
         29 . The multilayer ceramic electronic part of  claim 21 , further comprising a nickel plating layer and a tin plating layer on the conductive resin layer. 
     
     
         30 . A method of manufacturing a multilayer ceramic electronic part, comprising:
 forming a body portion including a dielectric layer and an internal electrode;   forming a first electrode layer on an end surface of the body portion to be electrically connected to an end of the internal electrode;   applying a conductive resin composition including a plurality of first conductivity-type metal particles, a thermosetting resin, and a second conductivity-type metal separate from the plurality of first conductivity-type metal particles, onto the first electrode layer; and   curing the thermosetting resin at a temperature higher than a melting point of the second conductivity-type metal and lower than a melting point of the plurality of first conductivity-type metal particles so as to convert the conductive resin composition to a conductive resin layer in which the second conductivity-type metal encompasses two or more of the plurality of first conductivity-type metal particles.   
     
     
         31 . The method of  claim 30 , wherein the two or more of the plurality of first conductivity-type metal particles encompassed by the second conductivity-type metal are electrically connected to each other by the second conductivity-type metal. 
     
     
         32 . The method of  claim 30 , wherein the second conductivity-type metal has the melting point of 300° C. or lower. 
     
     
         33 . The method of  claim 30 , wherein one of the plurality of first conductivity-type metal particles not encompassed by the second conductivity-type metal directly contacts the second conductivity-type metal. 
     
     
         34 . The method of  claim 30 , wherein the plurality of first conductivity-type metal particles contain one or more of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof. 
     
     
         35 . The method of  claim 30 , wherein the second conductivity-type metal is formed of an alloy of two or more selected from tin (Sn), lead (Pb), indium (In), copper (Cu), silver (Ag), and bismuth (Bi). 
     
     
         36 . The method of  claim 30 , further comprising plating a second electrode layer on the conductive resin layer. 
     
     
         37 . The method of  claim 30 , wherein the first electrode layer is formed by sintering a paste including a conductive metal and glass.