US2017177779A1PendingUtilityA1

Integrated Circuit Implementing Scalable Meta-Data Objects

Assignee: TELA INNOVATIONS INCPriority: Mar 9, 2006Filed: Mar 7, 2017Published: Jun 22, 2017
Est. expiryMar 9, 2026(expired)· nominal 20-yr term from priority
H10W 20/20G06F 30/367G06F 2119/18G06F 30/392G06F 30/394G06F 2217/12G06F 17/5072H01L 23/535H01L 29/42376H01L 29/0847G06F 17/5077G06F 17/5036H01L 27/0207H10D 89/10H10D 64/518H10D 62/151G06F 30/327
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Claims

Abstract

A method is disclosed for defining an integrated circuit. The method includes generating a digital data file that includes both electrical connection information and physical topology information for a number of circuit components. The method also includes operating a computer to execute a layout generation program. The layout generation program reads the electrical connection and physical topology information for each of the number of circuit components from the digital data file and automatically creates one or more layout structures necessary to form each of the number of circuit components in a semiconductor device fabrication process, such that the one or more layout structures comply with the physical topology information read from the digital data file. The computer is also operated to store the one or more layout structures necessary to form each of the number of circuit components in a digital format on a computer readable medium.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An integrated circuit, comprising:
 a first diffusion region having a size measured in a first direction in units of a first interconnect level pitch, the first diffusion region having a size measured in a second direction in units of one-quarter of a gate electrode pitch;   a second diffusion region having a size measured in the first direction in units of the first interconnect level pitch, the second diffusion region having a size measured in the second direction in units of one-quarter of the gate electrode pitch;   a gate electrode structure having a linear shape and a lengthwise centerline oriented in the first direction and positioned in accordance with the gate electrode pitch, the gate electrode structure positioned between the first diffusion region and the second diffusion region, the gate electrode structure having a length measured in the first direction in units of one-half of the first interconnect level pitch, the gate electrode structure having a width measured in the second direction to extend from the first diffusion region to the second diffusion region;   a local interconnect structure formed to physically contact the first diffusion region, the local interconnect structure having a size measured in the first direction that is at least as large as the first interconnect level pitch, the local interconnect structure having a size measured in the second direction in units of one-quarter of the gate electrode pitch;   a first interconnect level structure having a linear shape and a lengthwise centerline oriented in the second direction and positioned in accordance with the first interconnect level pitch; and   a contact structure extending between the local interconnect structure and the first interconnect level structure, the contact structure physically contacting both the local interconnect structure and the first interconnect level structure, the contact structure positioned in accordance with one-half of the gate electrode pitch.

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