US2017176186A1PendingUtilityA1
Angular velocity sensor having support substrates
Est. expirySep 30, 2031(~5.2 yrs left)· nominal 20-yr term from priority
H10W 72/884H10W 90/754H10W 90/752H10W 90/732H10W 72/30G01C 19/5769B81B 7/0048B81C 1/00238B81B 2201/025B81B 2207/07B81B 2203/0315G01P 15/0802B81C 1/0023B81B 2201/0242B81B 2203/0118H10N 30/302
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Claims
Abstract
An inertial force sensor that can suppress fluctuation of detection sensitivity even if an external stress is applied to the inertial force sensor. Angular velocity sensor ( 1 ), that is, an inertial force sensor includes ceramic substrate ( 6 ), lower lid ( 4 ) adhering to ceramic substrate ( 6 ) with adhesives ( 11 a and 11 b ) (first adhesives), and sensor element ( 2 ) adhering to lower lid ( 4 ) with adhesives ( 10 a and 10 b ) (second adhesives). The elastic moduli of adhesives ( 11 a and 11 b ) are smaller than those of adhesives ( 10 a and 10 b ).
Claims
exact text as granted — not AI-modified1 - 6 . (canceled)
7 . Angular velocity sensor having support substrates comprising:
a first substrate having an output terminal; a second substrate disposed on the first substrate, having a circuit carrying out at least one of a signal process selected from a synchronous detection process, a filter process or a correction process; a third substrate disposed on the second substrate; a fourth substrate disposed on the third substrate, having a frame part, a beam part connected to the frame part, a weight part connected to the beam part and an electrode pad disposed on the frame part; a bonding wire electrically connecting the electrode pad and the second substrate; a first connection layer disposed between the second substrate and the third substrate; and a second connection layer disposed between the third substrate and the fourth substrate; wherein the first substrate, the second substrate, the third substrate and the fourth substrate are stacked in this order, and wherein an elastic modulus of the first connection layer is smaller than an elastic modulus of the second connection layer.
8 . The angular velocity sensor having support substrates of claim 7 , wherein the electrode pad is disposed on an upper surface of the frame part of the fourth substrate.
9 . The angular velocity sensor having support substrates of claim 7 , wherein the weight part includes a first weight part, a second weight part, a third weight part and a fourth weight part, and
wherein the third substrate is provided with through-holes at positions corresponding to the first weight part, the second weight part, the third weight part and the fourth weight part.
10 . The angular velocity sensor having support substrates of claim 7 , wherein the weight part includes a first weight part, a second weight part, a third weight part and a fourth weight part;
the beam part includes a first beam part, a second beam part, a third beam part and a fourth beam part connected to respective one of the first weight part, the second weight part, the third weight part and the fourth weight part; the fourth substrate includes a center beam part connected to the first beam part, the second beam part, the third beam part and the fourth beam part, and a third layer is disposed between the center beam part and the third substrate.
11 . The angular velocity sensor having support substrates of claim 10 , wherein the connection layer is disposed below a center of the fourth substrate.
12 . The angular velocity sensor having support substrates of claim 7 , wherein the first substrate includes a cavity to accommodate the second substrate, the third substrate and the fourth substrate.
13 . The angular velocity sensor having support substrates of claim 7 ,
wherein the first substrate includes an electrode connected to the bonding wire, and wherein the first substrate comprises a ceramic material.
14 . The angular velocity sensor having support substrates of claim 7 ,
wherein each of the second substrate, the third substrate and the fourth substrate comprise a silicon.
15 . The angular velocity sensor having support substrates of claim 7 ,
wherein the fourth substrate includes a driver part to vibrate each of the weight parts and a detector part to detect a Coriolis force caused by an angular velocity applied to the angular velocity sensor.
16 . The angular velocity sensor having support substrates of claim 15 ,
wherein each of the driver part and the detector part comprises piezoelectric element.
17 . Angular velocity sensor having support substrates comprising:
a first substrate having an output terminal; a second substrate disposed on the first substrate, having a circuit carrying out at least one of a signal process selected from a synchronous detection process, a filter process or a correction process; a third substrate disposed on the second substrate; a fourth substrate disposed on the third substrate, having a frame part, a beam part connected to the frame part, a weight part connected to the beam part and an electrode pad disposed on the frame part; a bonding wire electrically connecting the electrode pad and the second substrate; a first connection layer disposed between the second substrate and the third substrate; and a second connection layer disposed between the third substrate and the fourth substrate; wherein the first substrate, the second substrate, the third substrate and the fourth substrate are stacked in this order, wherein the fourth substrate is thicker than the third substrate, and wherein an elastic modulus of the first connection layer is smaller than an elastic modulus of the second connection layer.
18 . The angular velocity sensor having support substrates of claim 17 ,
wherein the electrode pad is disposed on an upper surface of the frame part of the fourth substrate.
19 . The angular velocity sensor having support substrates 1 of claim 17 ,
wherein the weight part includes a first weight part, a second weight part, a third weight part and a fourth weight part, and
wherein the third substrate is provided with through-holes at positions corresponding to the first weight part, the second weight part, the third weight part and the fourth weight part.
20 . The angular velocity sensor having support substrates of claim 17 ,
wherein the weight part includes a first weight part, a second weight part, a third weight part and a fourth weight part; the beam part includes a first beam part, a second beam part, a third beam part and a fourth beam part connected to respective one of the first weight part, the second weight part, the third weight part and the fourth weight part; the fourth substrate includes a center beam part connected to the first beam part, the second beam part, the third beam part and the fourth beam part, and a third layer is disposed between the center beam part and the third substrate.
21 . The angular velocity sensor having support substrates of claim 20 ,
wherein the connection layer is disposed below a center of the fourth substrate.
22 . The angular velocity sensor having support substrates of claim 17 ,
wherein the first substrate includes a cavity to accommodate the second substrate, the third substrate and the fourth substrate, wherein the first substrate includes an electrode connected to the bonding wire, and wherein the first substrate comprises a ceramic material.
23 . The angular velocity sensor having support substrates of claim 17 ,
wherein the fourth substrate includes a driver part to vibrate each of the weight parts and a detector part to detect a Coriolis force caused by an angular velocity applied to the angular velocity sensor, and wherein each of the driver part and the detector part comprises piezoelectric element.
24 . The angular velocity sensor having support substrates of claim 8 , wherein
the second connection layer is provided at a lower surface of the forth substrate opposite to the electrode pad.
25 . The angular velocity sensor having support substrates of claim 7 , wherein
a space is provided between the second substrate and the third substrate.
26 . The angular velocity sensor having support substrates of claim 7 , wherein
a space is provided between the third substrate and the fourth substrate.Join the waitlist — get patent alerts
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