Heat dissipation module

Abstract

A heat dissipation module adapted to perform heat dissipation on a heat generating component is provided. The heat dissipation module includes a graphite sheet and an insulating and heat conducting layer. The graphite sheet includes a plurality of through holes, an attaching surface and a heat dissipating surface opposite to the attaching surface, wherein the attaching surface is configured to be attached to the heat generating component. Each of the through holes penetrates the graphite sheet, so the attaching surface and the heat dissipating surface are connected via the through holes. The insulating and heat conducting layer covers the graphite sheet. The insulating and heat conducting layer least covers the attaching surface, the heat dissipating surface and inner walls of the through holes.

What is claimed is: 
     
         1 . A heat dissipation module, configured to perform heat dissipation on a heat generating component, the heat dissipation module comprising:
 a graphite sheet including a plurality of through holes, an attaching surface and a heat dissipating surface, wherein the attaching surface is configured to be attached to the heat generating component, the heat dissipating surface is opposite to the attaching surface, and the through holes penetrate the graphite sheet, so the attaching surface and the heat dissipating surface are connected to each other via the through holes; and   an insulating and heat conducting layer covering the graphite sheet, wherein the insulating and heat conducting layer at least covers the attaching surface, the heat dissipating surface and inner walls of the through holes.   
     
     
         2 . The heat dissipation module as claimed in  claim 1 , further comprising an adhesive layer disposed on the attaching surface, such that the heat dissipation module is attached to the heat generating component through the adhesive layer. 
     
     
         3 . The heat dissipation module as claimed in  claim 2 , wherein the adhesive layer comprises a pressure sensitive adhesive (PSA). 
     
     
         4 . The heat dissipation module as claimed in  claim 2 , further comprising a release film disposed on a surface of the adhesive layer attaching to the heat generating component. 
     
     
         5 . The heat dissipation module as claimed in  claim 1 , wherein a thermal conductivity of the insulating and heat conducting layer along a vertical axis is substantially greater than or equal to 100 W/m·K. 
     
     
         6 . The heat dissipation module as claimed in  claim 1 , wherein a resistivity of the insulating and heat conducting layer is substantially greater than or equal to 10 5  Ω·cm. 
     
     
         7 . The heat dissipation module as claimed in  claim 1 , wherein material of the insulating and heat conducting layer comprises insulation carbide. 
     
     
         8 . The heat dissipation module as claimed in  claim 1 , wherein composition of the insulating and heat conducting layer comprises SiCx, and x substantially ranges from 0.5 to 1. 
     
     
         9 . The heat dissipation module as claimed in  claim 1 , wherein composition of the insulating and heat conducting layer comprises crystal structure of 3C—SiC. 
     
     
         10 . The heat dissipation module as claimed in  claim 1 , wherein a diameter of each of the through holes substantially ranges from 1 μm to 1000 μm. 
     
     
         11 . The heat dissipation module as claimed in  claim 1 , wherein a diameter of each of the through holes substantially ranges from 260 μm to 265 μm. 
     
     
         12 . The heat dissipation module as claimed in  claim 1 , wherein a thickness of the insulating and heat conducting layer is substantially greater than or equal to 1 μm, and substantially equal to or smaller than half of a diameter of each of the through holes. 
     
     
         13 . The heat dissipation module as claimed in  claim 1 , wherein a thickness of the insulating and heat conducting layer substantially ranges from 40 μm to 45 μm. 
     
     
         14 . The heat dissipation module as claimed in  claim 1 , wherein a thickness of the graphite sheet substantially ranges from 50 μm to 1 mm. 
     
     
         15 . The heat dissipation module as claimed in  claim 1 , wherein a thickness of the graphite sheet substantially ranges from 50 μm to 55 μm. 
     
     
         16 . The heat dissipation module as claimed in  claim 1 , wherein a cross section of each of the through holes is in circular, triangular or rectangular shape. 
     
     
         17 . The heat dissipation module as claimed in  claim 1 , wherein the insulating and heat conducting layer is formed by chemical vapor deposition (CVD) process. 
     
     
         18 . The heat dissipation module as claimed in  claim 17 , wherein temperature for the CVD process substantially ranges from 1000° C. to 1400° C. 
     
     
         19 . The heat dissipation module as claimed in  claim 17 , wherein pressure for the CVD process substantially ranges from 10 pa to 50000 pa. 
     
     
         20 . The heat dissipation module as claimed in  claim 17 , wherein the graphite sheet comprises pyrolytic graphite sheet (PGS).