Formable interface and shielding structures

Abstract

A formable structure comprises a first material having a first level of viscosity and a second material having a second level of viscosity, wherein the second material is formed to hold at least a portion of the first material in a particular position or a particular shape. The first material can be configured to function as a thermal interface between two or more hardware components. The second material can be configured to have a higher viscosity than the first material. In one illustrative example, the second material can include a light-activated resin that is configured to harden when exposed to one or more treatments. By the use of the first material and second material, the techniques disclosed herein are adaptable to gaps having a wide range of sizes, which is difficult to do with traditional thermal interface materials. The second material can also function as an EMI shield.

What is claimed is: 
     
         1 . A thermal conductor, comprising:
 a heat conduction material having a first level of viscosity; and   a dam having a second level of viscosity, the dam forms a barrier around at least a portion of the heat conduction material, and the second level of viscosity being sufficient for holding at least the portion of the heat conduction material in a predetermined form.   
     
     
         2 . The thermal conductor of  claim 1 , the heat conduction material including at least one of carbon-based particles, boron nitride, silica, alumina, metal particles, or a combination thereof. 
     
     
         3 . The thermal conductor of  claim 1 , the heat conduction material including at least one of an epoxy, a silicone, a urethane, an acrylic, or a combination thereof. 
     
     
         4 . The thermal conductor of  claim 1 , the heat conduction material including at least one of carbon-based particles, boron nitride, silica, alumina, or metal particles, and the heat conduction material includes at least one of an epoxy, a silicone, a urethane, or an acrylic. 
     
     
         5 . The thermal conductor of  claim 1 , the heat conduction material and the dam comprise a light-activated resin, the light-activated resin causes the heat conduction material and the dam to harden when exposed to a light-based treatment. 
     
     
         6 . The thermal conductor of  claim 1 , wherein the dam includes an electrically conductive filler, the electrically conductive filler causes the dam to be electrically conductive, the second level of viscosity is sufficient for holding the dam in a form for providing an electromagnetic interference shield for a component. 
     
     
         7 . The thermal conductor of  claim 1 , wherein the heat conduction material is formed to expose a first surface to a first component and a second surface to a second component. 
     
     
         8 . A method of forming a thermal conductor, comprising:
 applying a curable material to a surface of a first component, the curable material comprises a resin causes a viscosity of the curable material to increase when exposed to one or more treatments;   applying a protective mask configured to block one or more select portions of the curable material, thereby creating exposed portions of the curable material;   applying the one or more treatments to the curable material, thereby increasing a viscosity of the exposed portions of the curable material, wherein the application of the one or more treatments results in a first viscosity level for the one or more select portions and a second viscosity level for the exposed portions, the second viscosity level sufficient for holding the one or more select portions in a predetermined form, wherein a first surface of the one or more select portions is in contact with first component; and   mounting a second component on a second surface of the one or more select portions.   
     
     
         9 . The method of  claim 8 , the curable material including at least one of carbon-based particles, boron nitride, silica, alumina, metal particles, or a combination thereof. 
     
     
         10 . The method of  claim 8 , the curable material including at least one of an epoxy, a silicone, a urethane, an acrylic, or a combination thereof. 
     
     
         11 . The method of  claim 8 , the curable material including at least one of carbon-based particles, boron nitride, silica, alumina, or metal particles, and the curable material including at least one an epoxy, a silicone, a urethane, or an acrylic. 
     
     
         12 . The method of  claim 8 , the resin is a light-activated resin that causes the viscosity of the exposed portions of the curable material when exposed to a light-based treatment. 
     
     
         13 . The method of  claim 8 , the curable material includes an electrically conductive filler, the electrically conductive filler causes the curable material to be electrically conductive, the second viscosity level sufficient for holding the exposed portions in a position around the second component. 
     
     
         14 . A method of forming a thermal conductor, comprising:
 inserting a dam between a first component and a second component, the dam is formed to have an inner section at least partially surrounded one or more walls of the dam, and the dam has a viscosity level sufficient for holding at least a portion of a thermally conductive material in the inner section;   applying the thermally conductive material in the inner section with a filling device through an opening in the dam, wherein the thermally conductive material is configured to contact a surface of the first component and a surface of the second component; and   sealing the opening in the dam.   
     
     
         15 . The method of  claim 14 , the thermally conductive material including at least one of carbon-based particles, boron nitride, silica, alumina, metal particles, or a combination thereof. 
     
     
         16 . The method of  claim 14 , the thermally conductive material including at least one of an epoxy, a silicone, a urethane, an acrylic, or a combination thereof. 
     
     
         17 . The method of  claim 14 , the thermally conductive material including at least one of carbon-based particles, boron nitride, silica, alumina, and metal particles, the thermally conductive material including at least one of an epoxy, a silicone, a urethane, and an acrylic. 
     
     
         18 . The method of  claim 14 , wherein the dam includes a light-activated resin that causes the viscosity level to increase when the dam is exposed to a light-based treatment. 
     
     
         19 . The method of  claim 14 , wherein the dam comprises an electrically conductive filler, the electrically conductive filler causes the dam to be electrically conductive, the dam forming a cage around the second component. 
     
     
         20 . The method of  claim 14 , wherein sealing the opening in the dam comprises providing additional dam material to the close the opening. 
     
     
         21 . The method of  claim 14 , wherein the dam includes a self-healing material that causes the opening to seal upon the withdrawal of a filling device from the opening of the dam. 
     
     
         22 . A method of forming a thermal conductor, comprising:
 providing a curable material in a predetermined form, the curable material includes a resin causes a viscosity of the curable material to increase when exposed to one or more treatments;   applying a protective mask configured to block one or more select portions of the curable material, thereby creating exposed portions of the curable material; and   applying the one or more treatments to the curable material to increase a viscosity of the exposed portions of the curable material, the application of the one or more treatments results in a first viscosity level for the one or more select portions and a second viscosity level for the exposed portions, the second viscosity level sufficient for causing the exposed portions to hold the one or more select portions in the predetermined form.   
     
     
         23 . The method of  claim 22 , the curable material including at least one of carbon-based particles, boron nitride, silica, alumina, metal particles, or a combination thereof. 
     
     
         24 . The method of  claim 23 , the curable material including at least one of an epoxy, a silicone, a urethane, an acrylic, or a combination thereof. 
     
     
         25 . The method of  claim 23 , the curable material including at least one of carbon-based particles, boron nitride, silica, alumina, or metal particles, and the curable material including at least one an epoxy, a silicone, a urethane, or an acrylic. 
     
     
         26 . The method of  claim 23 , the resin is a light-activated resin that causes the viscosity of the exposed portions of the curable material when exposed to a light-based treatment.