Anodization architecture for electro-plate adhesion
Abstract
A chamber component for a processing chamber comprises a metallic article that comprises impurities. The chamber component further comprises a first anodization layer on the metallic article, the first anodization layer having a thickness greater than about 100 nm. The first anodization layer comprises a dense barrier layer portion and a porous columnar layer portion over the dense barrier layer portion, wherein the porous columnar layer portion comprises a plurality of pores that are free from moisture. The chamber component further comprises an aluminum coating on the first anodization layer, the aluminum coating being substantially free from impurities.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A chamber component for a processing chamber, comprising:
a metallic article that comprises impurities; a first anodization layer on the metallic article, the first anodization layer having a thickness greater than about 100 nm, wherein the first anodization layer comprises:
a dense barrier layer portion; and
a porous columnar layer portion over the dense barrier layer portion, wherein the porous columnar layer portion comprises a plurality of pores that are free from moisture; and
an aluminum coating on the first anodization layer, the aluminum coating being substantially free from impurities.
2 . The chamber component of claim 1 , wherein the aluminum coating has a thickness in a range from about 20 microns to about 80 microns.
3 . The chamber component of claim 1 further comprising a second anodization layer on the aluminum coating.
4 . The chamber component of claim 3 , wherein the second anodization layer has a thickness in a range from about 5 microns to about 30 microns.
5 . The chamber component of claim 3 , wherein an adhesion strength of the aluminum coating is 23-37 MPa.
6 . The chamber component of claim 3 , further comprising a ceramic layer on the second anodization layer.
7 . The chamber component of claim 6 , wherein the ceramic layer has a thickness in a range from about 100 microns to about 300 microns.
8 . The chamber component of claim 6 , wherein the ceramic layer has a thickness of about 2-10 microns.
9 . The chamber component of claim 6 , wherein the ceramic layer consists essentially of at least one of Y 2 O 3 , Al 2 O 3 , ZrO 2 , or a combination thereof.
10 . The chamber component of claim 6 , wherein the ceramic layer consists essentially of a plasma sprayed yttrium containing oxide.
11 . The chamber component of claim 6 , wherein an adhesion strength of the ceramic coating is about 14-25 MPa.
12 . The chamber component of claim 1 , wherein the chamber component is selected from a group consisting of a showerhead, a cathode sleeve, a sleeve liner door, a cathode base, a chamber liner, and an electrostatic chuck base.
13 . The chamber component of claim 1 , wherein the first anodization layer has an aspect ratio of an anodization column height to a pore diameter in a range from about 10 to 1 to about 2000 to 1.
14 . The chamber component of claim 13 , wherein the pore diameter of the first anodization layer is about 10-50 nm.
15 . The chamber component of claim 1 , wherein portions of the aluminum coating are infiltrated into the plurality of pores in the first anodization layer.
16 . The chamber component of claim 1 , wherein the aluminum coating is an electroplated coating.
17 . The chamber component of claim 1 , wherein the article comprises an aluminum alloy.
18 . The chamber component of claim 17 , wherein the aluminum alloy is Al 6061.
19 . The chamber component of claim 1 , wherein the aluminum coating has a surface roughness of about 20-300 micro-inches.Join the waitlist — get patent alerts
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