Transdermal sensing probes and smart patch systems using same

Abstract

An apparatus includes a substrate mechanically and electrically connected on one side of the substrate to multiple metallic probes in one or more arrays and includes the multiple metallic probes in the one or more arrays. In a method, multiple pits may be formed in an array on a first substrate. The pits have a pyramidal shape. A release layer is formed on the first substrate and covers surfaces of the pits. Probe tips are formed in the pits on the first substrate. The probe tips are formed from rigid conductive material. Multiple pillars are formed from rigid conductive material. The pillars are electrically and mechanically connected to a second substrate and to the probe tips. Release is caused of the probe tips from the first substrate, wherein the pillars and probe tips are connected to the second substrate and together form an array of rigid and conductive probes.

1 . An apparatus, comprising:
 a substrate mechanically and electrically connected on one side of the substrate to a plurality of metallic probes in one or more arrays; and   the plurality of metallic probes in the one or more arrays.   
     
     
         2 . The apparatus of  claim 1 , wherein at least some of the plurality of metallic probes have an anchor structure. 
     
     
         3 . The apparatus of  claim 2 , wherein the anchor structure for a probe comprises a pillar connected at a first end to the substrate and at a second end to a tip, and wherein a width of the pillar is less than a width of the tip at a junction where the pillar and tip are connected. 
     
     
         4 . The apparatus of  claim 3 , wherein the tip has a pyramid shape with a vertex and a base, the junction is at the base and the width of the base is larger than the width of the pillar at the junction. 
     
     
         5 . The apparatus of  claim 3 , wherein the tip has an arrow shape with a vertex and a base, the junction is at the base and the width of the base is larger than the width of the pillar at the junction. 
     
     
         6 . The apparatus of  claim 1 , wherein at least some of the plurality of metallic probes comprise a pillar connected at a first end to the substrate and at a second end to a tip. 
     
     
         7 . The apparatus of  claim 1 , wherein the substrate comprises a plurality of vias. 
     
     
         8 . The apparatus of  claim 7 , wherein at least some of the plurality of vias are openings and the apparatus comprises a breathable material connected to the substrate on a side of the substrate opposite the side of the substrate connected to the plurality of metallic probes. 
     
     
         9 . The apparatus of  claim 8 , wherein at least some of the plurality of vias are metallized and the apparatus comprises a heat spreading material connected to the substrate on a side of the substrate opposite the side of the substrate connected to the plurality of metallic probes. 
     
     
         10 . The apparatus of  claim 7 , wherein at least some of the plurality of vias are metallized and the apparatus comprises a heat spreading material connected to the substrate on a side of the substrate opposite the side of the substrate connected to the plurality of metallic probes. 
     
     
         11 . The apparatus of  claim 7 , wherein the substrate comprises a multi-layered device and at least some of the plurality of vias are metallized to electrically connect two or more of the layers. 
     
     
         12 . The apparatus of  claim 11 , wherein the substrate comprises one or more active circuits embodied in the multi-layered device. 
     
     
         13 . The apparatus of  claim 12 , wherein the one or more active circuits comprise circuitry for one or more of the following: signal collection, signal processing, data analysis, data transfer, or stimulation. 
     
     
         14 . The apparatus of  claim 11 , further comprising one or more elements attached to the substrate, the one or more elements comprising one or more of the following: an integrated circuit, microelectromechanical systems, an optical element or a group of optical elements, an antenna, a semiconductor heat spreader, an energy scavenging unit, a battery, or a capacitor. 
     
     
         15 . The apparatus of  claim 14 , wherein the substrate comprises one or more active circuits embodied in the multi-layered device. 
     
     
         16 . The apparatus of  claim 1 , wherein the substrate comprises one or more active circuits embodied in the multi-layered device. 
     
     
         17 . The apparatus of  claim 16 , wherein the one or more active circuits comprise circuitry for stimulation. 
     
     
         18 . The apparatus of  claim 17 , wherein the substrate comprises one or more network interfaces. 
     
     
         19 . The apparatus of  claim 16 , wherein the one or more active circuits comprise circuitry for one or more of the following: signal collection, signal processing, data analysis, or data transfer. 
     
     
         20 . The apparatus of  claim 16 , further comprising one or more elements attached to the substrate, the one or more elements comprising one or more of the following: an integrated circuit, microelectromechanical systems, an optical element or a group of optical elements, an antenna, a semiconductor heat spreader, an energy scavenging unit, a battery, or a capacitor. 
     
     
         21 . The apparatus of  claim 1 , further comprising one or more elements attached to the substrate, the one or more elements comprising one or more of the following: an integrated circuit, microelectromechanical systems, an optical element or a group of optical elements, an antenna, a semiconductor cooling unit, an energy scavenging unit, a battery, or a capacitor. 
     
     
         22 . The apparatus of  claim 1 , further comprising signal collection circuitry and one or more network interfaces, the signal collection circuitry configured to collect signals from the plurality of probes and to cause data corresponding to the signals to be transmitted to a remote device over the one or more network interfaces. 
     
     
         23 .- 29 . (canceled)