Micro- and Nanoscale Capacitors that Incorporate an Array of Conductive Elements Having Elongated Bodies

Abstract

Systems and methods in accordance with embodiments of the invention implement micro- and nanoscale capacitors that incorporate a conductive element that conforms to the shape of an array elongated bodies. In one embodiment, a capacitor that incorporates a conductive element that conforms to the shape of an array of elongated bodies includes: a first conductive element that conforms to the shape of an array of elongated bodies; a second conductive element that conforms to the shape of an array of elongated bodies; and a dielectric material disposed in between the first conductive element and the second conductive element, and thereby physically separates them.

What claimed is: 
     
         1 . A capacitor that incorporates a conductive element that conforms to the shape of an array of elongated bodies comprising:
 a first conductive element that conforms to the shape of an array of elongated bodies;   a second conductive element that conforms to the shape of an array of elongated bodies; and   a dielectric material that is disposed in between the first conductive element and the second conductive element, and thereby physically separates them;   wherein each of a plurality of elongated bodies defined by either the first conductive element or the second conductive element extend into the dielectric material such that the end of a respective elongated body that extends into the dielectric material is surrounded on all sides by the dielectric material.   
     
     
         2 . The capacitor of  claim 1 , wherein:
 the first conductive element and the second conductive element are distinct structures that are configured to interdigitate, but not physically contact one another.   
     
     
         3 . The capacitor of  claim 2 , wherein the inter-electrode gap is less than approximately 10 μm. 
     
     
         4 . The capacitor of  claim 2 , wherein the first conductive element and the second conductive element each conform to the shape of an array of cylinders. 
     
     
         5 . The capacitor of  claim 2 , wherein the first conductive element and the second conductive element each conform to the shape of an array of hexagonal elongated bodies. 
     
     
         6 . The capacitor of  claim 2 , wherein the first conductive element and the second conductive element each constitute an array of elongated bodies. 
     
     
         7 . The capacitor of  claim 2 , wherein the first conductive element and the second conductive element each constitute a coating deposited onto an array of elongated bodies. 
     
     
         8 . The capacitor of  claim 2 , wherein the dielectric material is Polybenzimidazole. 
     
     
         9 . The capacitor of  claim 1 , wherein:
 the first conductive element is a layer disposed onto an array of elongated bodies;   the dielectric material is a layer that is disposed onto the first conductive element; and   the second conductive element is a layer that is disposed onto the dielectric material.   
     
     
         10 . The capacitor of  claim 9 , wherein the array of elongated bodies comprises conductive silicon. 
     
     
         11 . The capacitor of  claim 10 , wherein the array of elongated bodies comprises a layer of dielectric material disposed onto the conductive silicon. 
     
     
         12 . The capacitor of  claim 11 , wherein the first conductive element and the second conductive element each comprise TiN. 
     
     
         13 . The capacitor of  claim 12 , wherein the dielectric material comprises Al 2 O 3 . 
     
     
         14 . The capacitor of  claim 9 , wherein the array of elongated bodies comprises carbon nanotubes. 
     
     
         15 . The capacitor of  claim 14 , wherein the array of elongated bodies comprises a silicon oxide layered onto the carbon nanotubes. 
     
     
         16 . The capacitor of  claim 15 , wherein the first conductive element and the second conductive element each comprise TiN. 
     
     
         17 . The capacitor of  claim 15 , further comprising:
 a second dielectric material;   a third conductive element;   a third dielectric material;   a fourth conductive element;   a fourth dielectric material; and   a fifth conductive element;   wherein:
 the second dielectric material is a layer disposed onto the second conductive element; 
 the third conductive element is a layer that is disposed onto the second dielectric material; 
 the third dielectric material is a layer disposed onto the third conductive element; 
 the fourth conductive element is a layer that is disposed onto the third dielectric material; 
 the fourth dielectric material is a layer that is disposed on the fourth conductive element; and 
 the fifth conductive element is a layer that is disposed onto the fourth dielectric material. 
   
     
     
         18 . The capacitor of  claim 1 , wherein the first conductive element, the second conductive element, and the dielectric material have similar coefficients of thermal expansion. 
     
     
         19 . The capacitor of  claim 1 , wherein the first conductive element, the second conductive element, and the dielectric material allow the capacitor to operate at within a temperature range from approximately 20° C. to 360° C. 
     
     
         20 . The capacitor of  claim 1 , wherein the dielectric material comprises one of: Celazole U-60; Celazole U-60SD; Celazole U-60ESD; Celazole TU-60; Celazole TF-60C; Celazole TF-60B; Celazole TL-60; polyetheretherketone (PEEK); BaTiO 3 ; and Al 2 O 3 .