Method for producing a sensor

Abstract

A method for producing a sensor which is equipped to detect a physical field as a function of a dimension to be measured using a measuring sensor and to emit an electrical output signal based on the detected physical field via a data cable, including:—placing the measuring sensor and the data cable on a mould defining the position of the measuring sensor and the data cable,—Coating the measuring sensor and the data cable positioned in the mould with a first material,—Removing the measuring sensor and data cable coated with the first material from the mould, and—Coating the measuring sensor and data cable removed from the mould and coated with the first material with a second material.

1 . A method for producing a sensor which is configured to detect a physical field, dependent on a variable to be measured, by a measuring sensor, and to output an electrical output signal on the basis of the detected physical field via a data cable, the method comprising:
 placing the measuring sensor and the data cable in a mold which defines a position of the measuring sensor and of the data cable, encapsulating the measuring sensor and data cable positioned in the mold with a first material, removing the measuring sensor and data cable encapsulated with the first material from the mold, and encapsulating the measuring sensor and data cable encapsulated with the first material and removed from the mold with a second material.   
     
     
         2 . The method as claimed in  claim 1 , wherein the mold comprises a positioning element with which the measuring sensor is positioned. 
     
     
         3 . The method as claimed in  claim 1 , wherein the mold comprises a shaping element on which the measuring sensor is shaped before or during the encapsulation with the first material. 
     
     
         4 . The method as claimed in  claim 3 , wherein the shaping element is a bending element. 
     
     
         5 . The method as claimed in  claim 1 , further comprising molding a positively locking element in the first material during the encapsulation of the measuring sensor and data cable, positioned in the mold, with the first material. 
     
     
         6 . The method as claimed in  claim 5 , further comprising molding a sealing contour around the positively locking element during the encapsulation of the measuring sensor and data cable, positioned in the mold, with a first material. 
     
     
         7 . The method as claimed in  claim 5 , further comprising inserting a securing element into the positively locking element, to which securing element the measuring sensor, encapsulated with the first material, and the data cable can be secured after the encapsulation with the first material. 
     
     
         8 . The method as claimed in  claim 1 , wherein the measuring sensor, encapsulated with the first material and removed from the mold, and the data cable are encapsulated with the second material in a non-cured state of the first material. 
     
     
         9 . The method as claimed in  claim 1 , her comprising forming a sealing contour which, when viewed in the direction of the data cable, runs around the first material, on the first material on a side of the data cable lying opposite the measuring sensor. 
     
     
         10 . A sensor for detecting a physical field, dependent on a variable to be measured, by a measuring sensor and for outputting an electrical output signal on the basis of the detected physical field of a data cable, which sensor is produced by a method as claimed in  claim 1 . 
     
     
         11 . A mold for use in a method as claimed in  claim 1 , comprising:
 a first mold part, and   a second mold part which is configure, for placement on the first mold part,   wherein the two mold parts form, when they are placed one on the other, a casting cavity in which the data cable, the measuring sensor and the first material can be at least partially accommodated, and   wherein a bending die is formed on the first mold part, and a recess is formed on the second mold part, for accommodating the bending die, by which bending die and recess the measuring sensor shaped when the second mold part is placed on the first mold part.   
     
     
         12 . The method as claimed in  claim 2 , wherein the mold comprises a shaping element on which the measuring sensor is shaped before or during the encapsulation with the first material. 
     
     
         13 . The method as claimed in  claim 6 , further comprising inserting a securing element into the positively locking element, to which securing element the measuring sensor, encapsulated with the first material, and the data cable can be secured after the encapsulation with the first material.