Ultra-capacitor structures and electronic systems with ultra-capacitor structures

Abstract

Ultra-capacitor structures and electronic systems and assemblies are provided. In one aspect, the ultra-capacitor structure is configured to selectively power and at least partially house electronic component(s) therein. In one embodiment, the ultra-capacitor structure includes a thermally conductive material facilitating dissipation of heat generated. In another embodiment, the ultra-capacitor structure includes an electrically conductive sheet facilitating electromagnetic shielding. In another aspect, an electronic system includes: an electronic device including electronic component(s); and a support structure physically receiving and electrically coupling to the electronic device, and including an ultra-capacitor structure configured to selectively power the electronic component(s) of the electronic device when electrically coupled to the support structure. In another aspect, an electronic assembly has a first region including electronic component(s), and a second region including an ultra-capacitor structure configured to selectively power the electronic component(s) of the electronic assembly, where the first region is spaced apart from the second region.

What is claimed is: 
     
         1 . A structure comprising:
 an ultra-capacitor structure, the ultra-capacitor structure being configured to selectively power and at least partially house one or more electronic components therein, the ultra-capacitor structure facilitating electromagnetic shielding of the one or more electronic components at least partially housed therein.   
     
     
         2 . The structure of  claim 1 , further comprising a thermally conductive material, the thermally conductive material facilitating dissipation of heat generated by the one or more electronic components at least partially housed within the ultra-capacitor structure. 
     
     
         3 . The structure of  claim 2 , wherein the thermally conductive material comprises one or more electrodes of the ultra-capacitor structure. 
     
     
         4 . The structure of  claim 1 , further comprising an electrically conductive sheet associated with the ultra-capacitor structure, the electrically conductive sheet facilitating the electromagnetic shielding of the one or more electronic components at least partially housed within the ultra-capacitor structure. 
     
     
         5 . The structure of  claim 4 , wherein the electrically conductive sheet comprises a current collector of the ultra-capacitor structure. 
     
     
         6 . The structure of  claim 1 , wherein the ultra-capacitor structure comprises a shock absorbent material at least partially surrounding the one or more electronic components housed within the ultra-capacitor structure, the shock absorbent material facilitating impact protection thereof. 
     
     
         7 . The structure of  claim 1 , further comprising a printed circuit board, the printed circuit board capable of mechanically supporting and electrically connecting the one or more electronic components and the ultra-capacitor structure. 
     
     
         8 . The structure of clam  1 , further comprising a battery, the battery capable of charging the ultra-capacitor structure thereof. 
     
     
         9 . The structure of  claim 1 , wherein the ultra-capacitor structure comprises multiple ultra-capacitor cells. 
     
     
         10 . An electronic system comprising:
 one or more electronic components;   an ultra-capacitor structure, the ultra-capacitor structure being configured to selectively power and at least partially house the one or more electronic components therein; and   wherein the ultra-capacitor structure comprises multiple layers, and the one or more electronic components are positioned between the multiple layers of the ultra-capacitor structure.   
     
     
         11 . The electronic system of  claim 10 , wherein the ultra-capacitor structure at least partially forms an outer shell of the electronic system. 
     
     
         12 . The electronic system of  claim 10 , wherein the electronic system comprises a mobile device, and the ultra-capacitor structure forms at least a partial outer housing of the mobile device to house the one or more electronic components therein. 
     
     
         13 . The electronic system of  claim 10 , wherein the ultra-capacitor structure comprises a thermally conductive material, the thermally conductive material facilitating dissipation of heat generated by the one or more electronic components at least partially housed within the ultra-capacitor structure. 
     
     
         14 . The electronic system of  claim 10 , wherein the ultra-capacitor structure comprises an electrically conductive sheet, the electrically conductive sheet facilitating electromagnetic shielding of the one or more electronic components at least partially housed within the ultra-capacitor structure. 
     
     
         15 . An electronic assembly comprising:
 a first region, the first region comprising one or more electronic components;   a second region, the second region comprising an ultra-capacitor structure, the ultra-capacitor structure being configured to selectively power the one or more electronic components of the electronic assembly, wherein the first region is spaced apart from the second region; and   wherein the electronic assembly is a headset device, and the second region comprises a headband portion thereof, wherein the ultra-capacitor structure comprises a portion of the headband portion of the headset device.   
     
     
         16 . The electronic assembly of  claim 15 , wherein the first region is smaller than the second region.