US2017159196A1PendingUtilityA1

Electrical deposition apparatus

Assignee: IND TECH RES INSTPriority: Dec 3, 2015Filed: Aug 30, 2016Published: Jun 8, 2017
Est. expiryDec 3, 2035(~9.4 yrs left)· nominal 20-yr term from priority
C25D 5/06C25D 21/18C25D 21/14
41
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Claims

Abstract

An electrical deposition apparatus includes a brush plating head. The brush plating head includes a plurality of channels, and there are openings at the same surface of the brush plating head. Each of the channels extends from within the brush plating head to each of the openings.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An electrical deposition apparatus, comprising a brush plating head, the brush plating head comprises a plurality of channels, and a plurality of openings is disposed at one surface of the brush plating head, wherein each of the channels extends from within the brush plating head to each of the openings. 
     
     
         2 . The electrical deposition apparatus according to  claim 1 , wherein the brush plating head has a plurality of pillar structures to form the plurality of channels. 
     
     
         3 . The electrical deposition apparatus according to  claim 1 , wherein the surface having the plurality of openings comprises a flat surface or an arc surface. 
     
     
         4 . The electrical deposition apparatus according to  claim 1 , further comprising a plating solution recycle device. 
     
     
         5 . The electrical deposition apparatus according to  claim 1 , further comprising a plating solution supply device used for supplying a plating solution to the brush plating head. 
     
     
         6 . The electrical deposition apparatus according to  claim 5 , wherein the brush plating head further comprises a plating solution supply duct used for supplying the plating solution to the channels. 
     
     
         7 . The electrical deposition apparatus according to  claim 5 , further comprising:
 a plating solution recycle device configured to recycle the plating solution; and   a pump configured to supply the recycled plating solution to the plating solution supply device.   
     
     
         8 . The electrical deposition apparatus according to  claim 1 , wherein the channels in the brush plating head are distributed at unequal distance. 
     
     
         9 . The electrical deposition apparatus according to  claim 8 , wherein a width of the channel located at an edge of the brush plating head is more than a width of the channel located at a center of the brush plating head. 
     
     
         10 . The electrical deposition apparatus according to  claim 1 , further comprising a friction pad covering at least the surface having the openings. 
     
     
         11 . The electrical deposition apparatus according to  claim 1 , further comprising a spacer disposed at the surface having the openings. 
     
     
         12 . The electrical deposition apparatus according to  claim 1 , wherein the brush plating head further comprises a connection channel connected to the plurality of channels. 
     
     
         13 . The electrical deposition apparatus according to  claim 12 , wherein the brush plating head further comprises an exhaust vent connected to the connection channel. 
     
     
         14 . The electrical deposition apparatus according to  claim 1 , further comprising a cover plate, disposed at the surface having the openings, wherein the cover plate comprises a plurality of through holes connected to the openings respectively. 
     
     
         15 . The electrical deposition apparatus according to  claim 14 , wherein the cover plate further comprises a plurality of blind holes disconnected from the openings. 
     
     
         16 . The electrical deposition apparatus according to  claim 14 , wherein each of the through holes has a fixed hole diameter. 
     
     
         17 . The electrical deposition apparatus according to  claim 14 , wherein a hole diameter of the through holes close to the brush plating head is more than a hole diameter of the through holes away from the brush plating head. 
     
     
         18 . The electrical deposition apparatus according to  claim 14 , wherein the through holes comprise a dot-shaped through hole, a slit through hole, a dashed-line through hole, or a combination thereof. 
     
     
         19 . The electrical deposition apparatus according to  claim 14 , wherein the cover plate further comprises a connection channel connected to the plurality of through holes. 
     
     
         20 . The electrical deposition apparatus according to  claim 19 , wherein the brush plating head further comprises an exhaust vent connected to the connection channel.

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