Thermosetting resin composition and prepreg and laminate obtained with the same

Abstract

The present invention provides a thermosetting resin composition comprising (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by a specific method, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin comprising specific monomer units and (D) an epoxy resin and a prepreg and a laminated plate which are prepared by using the same. The thermosetting resin composition of the present invention is balanced in all of a copper foil adhesive property, a heat resistance, a moisture absorption, a flame resistance, a metal-stuck heat resistance, a relative dielectric constant and a dielectric loss tangent. They have a low toxicity and are excellent in a safety and a working environment, and therefore a prepreg and a laminated plate which have excellent performances are obtained by using the above thermosetting resin composition.

What is claimed is: 
     
         1 . A thermosetting resin composition comprising:
 (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by reacting (a-1) a maleimide compound having at least two N-substituted maleimide groups in a molecule with (a-2) an amine compound having an acidic substituent represented by the following Formula (1) in an organic solvent,   (B) dicyandiamide, and   (C) a copolymer resin comprising (c-1) a monomer unit represented by the following Formula (3) and (c-2) a monomer unit represented by the following Formula (4):   
       
         
           
           
               
               
           
         
         wherein R 1  each represents independently an acidic substituent selected from a hydroxyl group, a carboxy group and a sulfonic acid group; R 2  each represents independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; x is an integer of 1 to 5, and y is an integer of 0 to 4; and a sum of x and y is 5; 
       
       
         
           
           
               
               
           
         
         wherein R 4  and R 5  each represent independently a hydrogen atom, a halogen atom, a hydrocarbon group having 1 to 5 carbon atoms, a phenyl group or a substituted phenyl group; 
       
       
         
           
           
               
               
           
         
       
     
     
         2 . The thermosetting resin composition according to  claim 1 , wherein the curing agent (A) is a compound represented by the following Formula (5) or the following Formula (6): 
       
         
           
           
               
               
           
         
         wherein R 1 , R 2 , x and y represent the same ones as in Formula (1); R 6  each represents independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom: 
       
       
         
           
           
               
               
           
         
         wherein R 1 , R 2 , x and y represent the same ones as in Formula (1); R 7  and R 8  each represents independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A is an alkylene group, an alkylidene group, an ether group, a sulfonyl group or a group represented by the following Formula (7); 
       
       
         
           
           
               
               
           
         
       
     
     
         3 . A prepreg obtained by impregnating or coating a base material with the thermosetting resin composition according to  claim 2  and then subjecting it to a B stage. 
     
     
         4 . A laminated plate obtained by laminating and molding the prepreg according to  claim 3 . 
     
     
         5 . The laminated plate according to  claim 4 , wherein it is a metal clad laminated plate obtained by superposing a metal foil on one side of the prepreg and then heating, pressing and molding it. 
     
     
         6 . A prepreg obtained by impregnating or coating a base material with the thermosetting resin composition according to  claim 1  and then subjecting it to a B stage. 
     
     
         7 . A laminated plate obtained by laminating and molding the prepreg according to  claim 6 . 
     
     
         8 . The laminated plate according to  claim 7 , wherein it is a metal clad laminated plate obtained by superposing a metal foil on one side of the prepreg and then heating, pressing and molding it.