Semiconductor device comprising power elements in juxtaposition order

Abstract

A semiconductor device including a multiplicity of large current power elements with each power element divided into a multiplicity of divisional elements and arranged such that the power elements belonging to different power elements are arranged in a repetitive sequential order. The IC chip of the semiconductor device is formed to have output wires extending from the respective divisional elements connected to corresponding output pads without crossing other output wires. Arranged on the IC chip are output bumps in association with the respective output pads. A rewiring layer is provided having output coupling wires for connecting together the bumps that belong to the same power element and connecting them further to an external output electrode.

What we claim is: 
     
         1 . A rectangular semiconductor device, comprising:
 a first semiconductor element;   a second semiconductor element;   a first conductor electrically connected to the first semiconductor element, the first conductor extending, in a plan view of the semiconductor device as seen from an obverse face thereof on which the first and second semiconductor elements are mounted, from the first semiconductor element toward one side of the semiconductor device;   a second conductor electrically connected to the second semiconductor element, the second conductor extending, in the plan view of the semiconductor device, from the second semiconductor element toward the one side of the semiconductor device;   a third conductor electrically connecting the first and second conductors together parallel to at least the one side of the semiconductor device; and   a fourth conductor disposed over, and apart from, the third conductor so as to cross the third conductor in the plan view of the semiconductor device, the fourth conductor being, at one end thereof, electrically connected to an internal circuit of the semiconductor device,   wherein, in the plan view of the semiconductor device as seen with the one side thereof on a near side,   a first distance from a first intersection, located on left of the fourth conductor, between the first and third conductors to the fourth conductor
 is shorter than 
   a second distance from a second intersection, located on right of the fourth conductor, between the second and third conductors to the fourth conductor.   
     
     
         2 . The semiconductor device according to  claim 1 , wherein the first semiconductor element is controlled by a control circuit connected thereto. 
     
     
         3 . The semiconductor device according to  claim 1 , wherein the second semiconductor element is controlled by a control circuit connected thereto. 
     
     
         4 . The semiconductor device according to  claim 2 , wherein the second semiconductor element is controlled by the control circuit connected thereto. 
     
     
         5 . The semiconductor device according to  claim 1 , wherein the fourth conductor is, at another end thereof, connected to an electrode.