SMD Diode Taking A Runner As Body And Manufacturing Method Thereof

Abstract

A surface mount (SMD) diode taking a runner as the body and a manufacturing method thereof are described. An elongated runner groove is adopted to cure and package groups of diode chips arranged side by side and corresponding copper pins thereon, with the utilization rate of epoxy resin up to 90% or more. The use cost of epoxy resin is thus reduced, and environmental pollution is also reduced.

What is claimed is: 
     
         1 . A surface mount (SMD) diode taking a runner as the body, comprising:
 a chip;   a positive pin;   a negative pin connected respectively with upper and lower surfaces of the chip; and   a plastic-packaged body wrapped on an outside of the chip,   wherein:
 both the positive pin and the negative pin, each having two bends, extend out of a bottom of the plastic-packaged body in two opposite directions, and 
 a cambered surface, is provided on a part of each of the positive pin and the negative pin extending out of the plastic-packaged body. 
   
     
     
         2 . The SMD diode of  claim 1 , wherein each of the positive pin and the negative pin comprises a sheet copper pin having two bends each at an angle of 90°. 
     
     
         3 . The SMD diode of  claim 1 , wherein each of the positive pin and the negative pin is provided with a tin solder layer at a respective junction with the chip. 
     
     
         4 . The SMD diode of  claim 1 , wherein the upper and lower surfaces of the plastic-packaged body are smooth, and wherein surfaces of both sides of the positive pin and the negative pin are rough. 
     
     
         5 . The SMD diode of  claim 1 , wherein an external shape of the plastic-packaged body is rectangular. 
     
     
         6 . A passive electronic component, comprising:
 multiple groups of surface mount (SMD) diodes that are arranged side by side, each of the SMD diodes comprising:
 a chip; 
 a positive pin; 
 a negative pin connected respectively with upper and lower surfaces of the chip; and 
 a plastic-packaged body wrapped on an outside of the chip, 
 wherein:
 both the positive pin and the negative pin, each having two bends, extend out of a bottom of the plastic-packaged body in two opposite directions, 
 a cambered surface, is provided on a part of each of the positive pin and the negative pin extending out of the plastic-packaged body, and 
 the plastic-packaged bodies of adjacent SMD diodes are integrally molded. 
 
   
     
     
         7 . The passive electronic component of  claim 6 , wherein, for each of the SMD diodes, each of the positive pin and the negative pin comprises a sheet copper pin having two bends each at an angle of 90°. 
     
     
         8 . The passive electronic component of  claim 6 , wherein, for each of the SMD diodes, each of the positive pin and the negative pin is provided with a tin solder layer at a respective junction with the chip. 
     
     
         9 . The passive electronic component of  claim 6 , wherein, for each of the SMD diodes, the upper and lower surfaces of the plastic-packaged body are smooth, and wherein surfaces of both sides of the positive pin and the negative pin are rough. 
     
     
         10 . The passive electronic component of  claim 6 , wherein, for each of the SMD diodes, an external shape of the plastic-packaged body is rectangular. 
     
     
         11 . A method of manufacturing a surface mount (SMD) diode taking a runner as the body, the method comprising:
 welding and filming multiple groups of diode chips and corresponding copper pins thereon simultaneously;   disposing the multiple groups of the welded diode chips and the corresponding copper pins thereon side by side into an elongated runner groove of an injection mold;   injecting a plastic-packaging material into the elongated runner groove;   curing and packaging the multiple groups of the welded diode chips and the corresponding copper pins thereon simultaneously to obtain a plastic-packaged body containing the multiple groups of the diode chips and the copper pins thereon;   dipping a part of the copper pins extending out of the plastic-packaged body into a liquid tin;   cutting the plastic-packaged body, which contains the multiple groups of the diode chips and the copper pins thereon, into a plurality of single-chip SMD diodes; and   testing and packaging the plurality of single-chip SMD diodes.   
     
     
         12 . The method of  claim 11 , wherein, when each group of the multiple groups of diode chips comprises one diode chip, the one diode chip is welded to corresponding two of the copper pins, wherein, when each group of the multiple groups of diode chips comprises two diode chips, the two diode chips are welded to corresponding three of the copper pins, and wherein, when each group of the multiple groups of diode chips comprises four diode chips, the four diode chips are welded to corresponding four of the copper pins. 
     
     
         13 . The method of  claim 11 , wherein each of the copper pins comprises a sheet copper pin bent twice each time at an angle of 90°. 
     
     
         14 . The method of  claim 12 , wherein each of the copper pins comprises a sheet copper pin bent twice each time at an angle of 90°. 
     
     
         15 . The method of  claim 11 , wherein the plastic-packaging material comprises epoxy resin. 
     
     
         16 . The method of  claim 11 , wherein after the dipping of the part of the copper pins extending out of the plastic-packaged body into the liquid tin, a tin-dipped layer having a cambered surface is formed on the part of the copper pins extending out of the plastic-packaged body under surface tension effect of the liquid tin. 
     
     
         17 . The method of  claim 11 , wherein after the cutting of the plastic-packaged body is finished, upper and lower surfaces of the plastic-packaged body of each single-chip SMD diode are smooth, and wherein surfaces of both sides of the copper pins are rough.