Microchannel heat transfer with liquid metals
Abstract
A apparatus for controlling heat transfer between portions of a substrate is provided. The apparatus includes a substrate including at least part of a hydraulic circuit, the hydraulic circuit including a plurality of microconduits, the plurality of microconduits including a first microconduit and a second microconduit. The apparatus further includes a liquid metal flowing through the hydraulic circuit and a magnetic field configured to selectively direct the flow of the liquid metal between the plurality of microconduits. The flow of the liquid metal through the hydraulic circuit transfers heat between a first portion of the substrate and the liquid metal.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An apparatus for controlling heat transfer between portions of a microcomponent comprising:
a microcomponent having a first microconduit; a liquid metal flowing through the first microconduit; and a magnetic field source for providing a magnetic field acting within the microcomponent and configured to control the flow of the liquid metal, wherein the magnetic field is activated to initiate the flow of the liquid metal in a desired direction and is inactivated after the flow is initiated such that the flow of liquid metal continues in the desired direction via surface tension; wherein the flow of the liquid metal through the microconduit transfers heat between a first portion of the microcomponent and the liquid metal.
2 . The apparatus of claim 1 , wherein the liquid metal electrically transports a signal.
3 . The apparatus of claim 2 , further comprising a second microconduit having a second signal receptor;
wherein the first microconduit comprises a first signal receptor; and wherein the magnetic field is configured to selectively direct the flow of the liquid metal between the first and second microconduits, and wherein when the liquid metal is directed to the first microconduit, the signal is received by the first signal receptor, and when the liquid metal is directed to the second microconduit, the signal is received by the second signal receptor.
4 . The apparatus of claim 1 , further comprising magnetic particles dispersed within the liquid metal;
wherein the magnetic field applies a force to the magnetic particles.
5 . The apparatus of claim 1 , wherein the magnetic field applies a magneto-hydrodynamic force to the liquid metal by interaction with a current within the liquid metal.
6 . The apparatus of claim 1 , further comprising a ferromagnetic portion, wherein the ferromagnetic portion is located along the microconduit to locally modulate the magnetic field.
7 . The apparatus of claim 1 , further comprising a paramagnetic portion, wherein the paramagnetic portion is located along the microconduit to locally modulate the magnetic field.
8 . The apparatus of claim 1 , further comprising a second microconduit branching from the first microconduit at a junction.
9 . The apparatus of claim 1 , wherein the microcomponent comprises a first microconduit network and a second microconduit network, and wherein the microconduit forms at least a portion of the first microconduit network.
10 . The apparatus of claim 1 , wherein the magnetic field controls flow of the liquid metal in a longitudinal direction through the microconduit.
11 . The apparatus of claim 1 , further comprising a second microconduit and a third microconduit, wherein the magnetic field selectively directs the flow of the liquid metal from the third microconduit between the first microconduit and the second microconduit.
12 . The apparatus of claim 1 , wherein the microconduit comprises an upstream segment located upstream of a junction and at least two downstream segments located downstream of the junction;
wherein the magnetic field determines what fraction of the flow flows through each of the downstream segment.
13 . The apparatus of claim 1 , further comprising:
a junction including a bistable fluidic structure; a first segment of the microconduit fluidly coupled to the junction; a second segment of the microconduit fluidly coupled to the junction; and a third segment of the microconduit fluidly coupled to the junction; wherein the magnetic field provides switching forces between the first and second microconduits so as to selectively direct the flow of liquid metal between the plurality of microconduits.
14 . The apparatus of claim 1 , further comprising processing electronics configured to control the flow of the liquid metal by controlling at least one of the magnetic field and a current within the liquid metal.
15 . An apparatus for controlling heat transfer between portions of a substrate comprising:
a substrate including at least part of a hydraulic circuit, the hydraulic circuit comprising a plurality of microconduits, the plurality of microconduits including a first microconduit and a second microconduit; a liquid metal flowing through the hydraulic circuit; and an electric field source for providing an electric field to selectively direct the flow of the liquid metal between the plurality of microconduits, wherein the electric field is activated to initiate the flow of the liquid metal in a desired direction and is inactivated after the flow is initiated such that the flow of liquid metal continues in the desired direction via a surface tension; wherein the flow of the liquid metal through the hydraulic circuit transfers heat between a first portion of the substrate and the liquid metal.
16 . The apparatus of claim 15 , wherein the liquid metal electrically transports a signal.
17 . The apparatus of claim 16 , wherein the first microconduit comprises a first signal receptor, and the second microconduit comprises a second signal receptor; and
wherein when the liquid metal is directed to the first microconduit, the signal is received by the first signal receptor, and when the liquid metal is directed to the second microconduit, the signal is received by the second signal receptor.
18 . The apparatus of claim 15 , further comprising an electric field source.
19 . The apparatus of claim 15 , wherein the second microconduit branches from the first microconduit at a junction.
20 . The apparatus of claim 15 , wherein the substrate comprises a second hydraulic circuit.
21 . The apparatus of claim 15 , further comprising a second electric field;
wherein sequential activation of the first and second electric field control flow of the liquid metal in a longitudinal direction through the first microconduit.
22 . The apparatus of claim 15 , wherein the hydraulic circuit comprises a third microconduit, wherein the electric field selectively directs the flow of the liquid metal from the third microconduit between the first microconduit and the second microconduit.
23 . The apparatus of claim 15 , wherein the hydraulic circuit comprises:
a junction including a bistable fluidic structure, each of the first microconduit and the second microconduit fluidly coupled to the junction; and a third microconduit fluidly coupled to the junction; wherein the electric field provides switching forces between the first and second microconduits so as to selectively direct the flow of liquid metal between the plurality of microconduits.
24 . The apparatus of claim 15 , further comprising processing electronics configured to direct the flow of the liquid metal by controlling the electric field.
25 . An apparatus for controlling heat transfer between portions of a microcomponent comprising:
a microcomponent including at least part of a hydraulic circuit, the hydraulic circuit comprising a plurality of microconduits, the plurality of microconduits including a first microconduit and a second microconduit; a liquid metal flowing through the hydraulic circuit; and an electric field source for providing an electric field acting within the microcomponent and configured to selectively direct the flow of the liquid metal between the at least two microconduits, wherein the electric field is activated to initiate the flow of the liquid metal in a desired direction and is inactivated after the flow is initiated such that the flow of liquid metal continues in the desired direction via a surface tension; wherein the flow of the liquid metal through the hydraulic circuit transfers heat between a first portion of the microcomponent and the liquid metal.
26 . The apparatus of claim 25 , wherein the liquid metal electrically transports a signal.
27 . The apparatus of claim 26 , wherein the first microconduit comprises a first signal receptor, and the second microconduit comprises a second signal receptor; and
wherein when the liquid metal is directed to the first microconduit, the signal is received by the first signal receptor, and when the liquid metal is directed to the second microconduit, the signal is received by the second signal receptor.
28 . The apparatus of claim 25 , further comprising an electric field source.
29 . The apparatus of claim 25 , further comprising a second electric field;
wherein sequential activation of the first and second electric field control flow of the liquid metal in a longitudinal direction through the first microconduit.
30 . The apparatus of claim 25 , wherein the hydraulic circuit comprises a third microconduit, wherein the electric field selectively directs the flow of the liquid metal from the third microconduit between the first microconduit and the second microconduit.
31 . The apparatus of claim 25 , wherein the hydraulic circuit comprises:
a junction including a bistable fluidic structure, each of the first microconduit and the second microconduit fluidly coupled to the junction; and a third microconduit fluidly coupled to the junction; wherein the electric field provides switching forces between the first and second microconduits so as to selectively direct the flow of liquid metal between the plurality of microconduits.
32 . The apparatus of claim 25 , further comprising processing electronics configured to direct the flow of the liquid metal by controlling the electric field.
33 . The apparatus of claim 25 , wherein the first portion of the microcomponent is configured to transfer heat to the liquid metal.
34 . The apparatus of claim 25 , wherein the microcomponent comprises a second portion configured to transfer heat between the liquid metal and the microcomponent.
35 . The apparatus of claim 25 , wherein the first portion comprises a heat transfer site having the liquid metal flowing through the first microconduit passing therethrough.Join the waitlist — get patent alerts
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