Package-on-package modules, electronic systems including the same, and memory cards including the same

Abstract

Package-on-package (PoP) modules are provided. The PoP module includes a lower package and an upper package disposed over the lower package. The lower package includes a lower substrate and a lower chip disposed over a top surface of the lower substrate. The upper package includes an upper substrate, a plurality of upper chips disposed over a top surface of the upper substrate, and an upper molding member disposed over the plurality of upper chips. The upper molding member is divided into at least two parts which are separated from each other by a trench. Related memory cards and related electronic systems are also provided.

What is claimed is: 
     
         1 . A package-on-package (PoP) module comprising:
 a lower package including a lower substrate, a lower chip disposed over a top surface of the lower substrate, and a lower molding member covering the lower chip; and   an upper package disposed over the lower molding member of the lower package, wherein the upper package includes an upper substrate, a plurality of upper chips laterally disposed over a top surface of the upper substrate, and an upper molding member entirely covering the plurality of upper chips,   wherein the upper molding member is divided into at least two parts separated from each other by a trench, and   wherein the trench exposed the top surface of the upper substrate.   
     
     
         2 . The PoP module of  claim 1 , further comprising a connection member disposed between the lower substrate and the upper substrate. 
     
     
         3 . The PoP module of  claim 2 , wherein the connection member includes a solder ball. 
     
     
         4 . The PoP module of  claim 1 , wherein the plurality of upper chips are spaced apart from each other and are arranged in a first direction. 
     
     
         5 . The PoP module of  claim 4 , wherein the trench extends in a second direction which is substantially perpendicular to the first direction. 
     
     
         6 . The PoP module of  claim 1 , further comprising a buffer layer disposed within the trench. 
     
     
         7 . The PoP module of  claim 6 , wherein the buffer layer includes a polymeric material. 
     
     
         8 . The PoP module of  claim 6 , wherein a surface of the buffer layer and a surface of the divided upper molding member are coplanar. 
     
     
         9 . The PoP module of  claim 1 , wherein the plurality of upper chips are spaced apart from each other and are two dimensionally arrayed along first and second directions. 
     
     
         10 . The PoP module of  claim 9 , wherein the first and second directions are substantially perpendicular to each other. 
     
     
         11 . The PoP module of  claim 9 ,
 wherein the trench includes a first trench located between two of the plurality of upper chips and a second trench located between two of the plurality of upper chips; and   wherein the first trench and the second trench are oriented in the second direction and the first direction, respectively.