Method for manufacturing electro-optical device, electro-optical device, and electronic apparatus

Abstract

After a first wafer on which mirrors and terminals are formed and a second wafer for sealing are stacked and bonded together, the first wafer and the second wafer are diced to manufacture electro-optical devices. In doing so, in a second surface of the second wafer, recesses overlapping the mirrors in a plan view are previously formed, and also grooves overlapping the terminals in the plan view are previously formed. For this reason, when the second wafer is diced along the grooves by advancing a dicing blade for second wafer from a third surface of the second wafer, the dicing blade for second wafer can be prevented from coming into contact with the terminal.

What is claimed is: 
     
         1 . An electro-optical device comprising:
 an element substrate including a mirror and a terminal on a first surface side, the terminal being provided at a position next to the mirror in a plan view, the terminal being electrically connected to a drive element driving the mirror; and   a sealing member including a spacer and a plate-like light-transmitting cover, the spacer being bonded on the first surface side of the element substrate and surrounding the mirror in the plan view, the light-transmitting cover being supported to an edge of the spacer on the side opposite to an edge thereof facing the element substrate, the light-transmitting cover overlapping the mirror in the plan view, wherein   in a side surface of the sealing member, a second portion closer to the element substrate than a first portion projects opposite to the mirror beyond the first portion.   
     
     
         2 . The electro-optical device according to  claim 1 , wherein
 the first portion projects opposite to the mirror beyond the first portion beyond an edge of the cover such that the spacer has a curved outer wall.   
     
     
         3 . An electronic apparatus comprising the electro-optical device according to  claim 1 , wherein
 the electronic apparatus includes a light source unit that irradiates the mirror with light source light.   
     
     
         4 . An electro-optical device comprising:
 an element substrate including a mirror and a terminal on a first surface side, the terminal being provided at a position next to the mirror in a plan view, the terminal being electrically connected to a drive element driving the mirror; and   a sealing member including a spacer and a plate-like light-transmitting cover, the spacer being bonded on the first surface side of the element substrate and surrounding the mirror in the plan view, the light-transmitting cover being supported to an edge of the spacer on the side opposite to an edge thereof facing the element substrate, the light-transmitting cover overlapping the mirror in the plan view, wherein   in aside surface of the sealing member, a second portion closer to the element substrate than a first portion is recessed to the mirror side beyond the first portion.   
     
     
         5 . The electro-optical device according to  claim 4 , wherein
 the first portion that is recessed to the mirror side beyond the first portion defines a recessed portion within an edge of the cover such that the spacer has a stepwise outer wall forming a gap between the cover and the element substrate   
     
     
         6 . An electronic apparatus comprising the electro-optical device according to  claim 4 , wherein
 the electronic apparatus includes a light source unit that irradiates the mirror with light source light.