Oled thin film packaging structure, packaging method thereof and display device thereof

Abstract

The disclosure provides an OLED thin film packaging structure, a packaging method thereof and a display device thereof. The packaging structure comprises: a base substrate; an OLED device, disposed on the base substrate; and a first passivation layer, covering the OLED device; wherein, a surface of the first passivation layer away from the OLED device comprises at least one thinning region, and the thickness of the thinning region is thinner than the thickness of the first passivation layer. Thus, the disclosure can enhance the bending property of the flexible OLED device packaging portion.

What is claimed is: 
     
         1 . An OLED device packaging structure, wherein the packaging structure comprises:
 a base substrate;   an OLED device, disposed on the base substrate; and   a first passivation layer, covering the OLED device;   wherein, a surface of the first passivation layer away from the OLED device comprises at least one thinning region, and the thickness of the thinning region is thinner than the thickness of the first passivation layer.   
     
     
         2 . The packaging structure according to  claim 1 , wherein the thinning region comprises a plurality of banding regions interlacing with each other. 
     
     
         3 . The packaging structure according to  claim 1 , wherein the thinning region comprises a plurality of rectangular regions disposed alternatively. 
     
     
         4 . The packaging structure according to  claim 1 , wherein the packaging structure further comprises a second passivation layer covering the first passivation layer, a surface of the second passivation layer away from the OLED device comprises at least one thinning region, and the thickness of the thinning region is thinner than the thickness of the second passivation layer. 
     
     
         5 . The packaging structure according to  claim 4 , wherein the thinning region of the first passivation layer and the thinning region of the second passivation layer are disposed alternatively. 
     
     
         6 . The packaging structure according to  claim 4 , wherein the packaging structure further comprises a buffering layer, disposed between the first passivation layer and the second passivation layer, one surface of the buffering layer closed to the OLED device comprises at least one thickening region, configured for laminating with the thinning region of the first passivation layer. 
     
     
         7 . A display device, wherein the display device comprises an OLED device packaging structure, the packaging structure comprises:
 a base substrate;   an OLED device, disposed on the base substrate; and   a first passivation layer, covering the OLED device;   wherein, a surface of the first passivation layer away from the OLED device comprises at least one thinning region, and the thickness of the thinning region is thinner than the thickness of the first passivation layer.   
     
     
         8 . The display device according to  claim 7 , wherein the thinning region comprises a plurality of banding regions interlacing with each other. 
     
     
         9 . The display device according to  claim 7 , wherein the thinning region comprises a plurality of rectangular regions disposed alternatively. 
     
     
         10 . The display device according to  claim 7 , wherein the packaging structure further comprises a second passivation layer covering the first passivation layer, a surface of the second passivation layer away from the OLED device comprises at least one thinning region, and the thickness of the thinning region is thinner than the thickness of the second passivation layer. 
     
     
         11 . The display device according to  claim 10 , wherein the thinning region of the first passivation layer and the thinning region of the second passivation layer are disposed alternatively. 
     
     
         12 . The display device according to  claim 10 , wherein the packaging structure further comprises a buffering layer, disposed between the first passivation layer and the second passivation layer, one surface of the buffering layer closed to the OLED device comprises at least one thickening region, configured for laminating with the thinning region of the first passivation layer. 
     
     
         13 . A method for packaging an OLED device, wherein thepackaging method comprises:
 providing abase substrate;   forming an OLED device on the base substrate;   forming first passivation layer covering the OLED device; and   forming at least one thinning region on the first passivation layer, and the thickness of the thinning region is thinner than a normal thickness of the first passivation layer.   
     
     
         14 . The method according to  claim 13 , wherein after the step of forming at least one thinning region on the first passivation layer, and the thickness of the thinning region is thinner than a normal thickness of the first passivation layer, the method further comprises:
 forming a buffering layer on the first passivation layer;   forming a second passivation layer on the buffering layer; and   forming at least one thinning region on the second passivation layer, and the thickness of the thinning region is thinner than a normal thickness of the second passivation layer.   
     
     
         15 . The method according to  claim 14 , wherein the thinning region of the first passivation layer and the thinning region of the second passivation layer are disposed alternatively.