Magnetic field current sensors

Abstract

A magnetic field current sensor including a die having at least one magnetic field sensing element; a plurality of contacts disposed in a first plane and coupled to the die; a conductor comprising first and second contact portions, the first and second contacts electrically coupled and disposed in a second plane different from the first plane, and the conductor coupled to and electrically isolated from the die; and a mold body enclosing the die, the plurality of contacts, and the first and second contact portions.

What is claimed is: 
     
         1 . A magnetic field current sensor comprising:
 a die having at least one magnetic field sensing element;   a plurality of contacts disposed in a first plane and coupled to the die;   a conductor comprising first and second contact portions, the first and second contacts electrically coupled and disposed in a second plane different from the first plane, and the conductor coupled to and electrically isolated from the die; and   a mold body enclosing the die, the plurality of contacts, and the first and second contact portions.   
     
     
         2 . The magnetic field current sensor of  claim 1 , further comprising a ring-shaped seal arranged adjacent the mold body to prevent creepage current between the first and second planes along a surface of the mold body. 
     
     
         3 . The magnetic field current sensor of  claim 2 , wherein the ring-shaped seal comprises an O-ring. 
     
     
         4 . The magnetic field current sensor of  claim 1 , wherein the seal comprises at least part of a shoulder structure configured for mounting in a sensor module. 
     
     
         5 . The magnetic field current sensor of  claim 4 , wherein the sensor module is configured to be mounted to a printed circuit board. 
     
     
         6 . The magnetic field current sensor of  claim 1 , wherein the seal is arranged between the first and second planes. 
     
     
         7 . The magnetic field current sensor of  claim 1 , wherein the seal is disposed in one of the first or second planes. 
     
     
         8 . The magnetic field current sensor of  claim 1 , wherein the plurality of contacts couple the die to a leadframe. 
     
     
         9 . The magnetic field current sensor of  claim 1 , wherein the first plane is above the second plane. 
     
     
         10 . The magnetic field current sensor of  claim 9 , wherein the die is between the first and second planes. 
     
     
         11 . The magnetic field current sensor of  claim 1 , wherein the conductor comprises first and second pillar portions and a footprint portion, the first and second pillar portions coupling the first and second contact portions, respectively, to the footprint portion.