US2017138882A1PendingUtilityA1
Capacitive humidity sensor
Assignee: MAGNACHIP SEMICONDUCTOR LTDPriority: Sep 6, 2013Filed: Jan 30, 2017Published: May 18, 2017
Est. expirySep 6, 2033(~7.1 yrs left)· nominal 20-yr term from priority
G01N 27/225G01N 27/22G01N 27/223G01R 27/26H01G 7/00
56
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Claims
Abstract
Provided is a capacitive humidity sensor. The capacitive humidity sensor includes an upper electrode disposed on a first plane, a plurality of first electrodes included in the upper electrode, a plurality of second electrodes disposed between the first electrodes, and a humidity sensitive layer surrounding the second electrodes.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of fabricating a capacitive humidity sensor, the method comprising:
forming a first electrode and a second electrode in a sensing region over a substrate; forming a pad electrode in a pad region over the substrate; forming a passivation layer over the sensing region and the pad region including the pad electrode, the first electrode and the second electrode; removing a portion of the passivation layer from the sensing region to form a first groove between the first electrode and the second electrode, and a second groove between the first electrode and the pad electrode; and disposing a humidity sensitive layer in the first and second grooves, and wherein the first groove extends below a bottom surface of the first electrode.
2 . The method of claim 1 , further comprising forming a first protection layer over the passivation layer following the removing the portion of the passivation layer.
3 . The method of claim 2 , further comprising exposing the pad electrode by removing the first protection layer and the passivation layer.
4 . The method of claim 1 , wherein depth of the first groove is different from depth of the second groove.
5 . The method of claim 1 , wherein the second groove is deeper than the first groove.
6 . The method of claim 1 , wherein the passivation layer comprises a HDP silicon oxide layer.
7 . The method of claim 1 , wherein the removing the passivation layer is performed until upper portions of the first electrode and the second electrode are formed in the curved shapes.
8 . The method of claim 7 , wherein the passivation layer formed over the sensing region is completely removed.
9 . The method of claim 1 , further comprising forming a second protection layer over the humidity sensitive layer.
10 . The method of claim 1 , wherein the second electrode comprises discrete electrodes.
11 . The method of claim 10 , wherein the humidity sensitive layer is disposed between each of a pair of adjacent discrete electrodes.
12 . A method of fabricating a capacitive humidity sensor, the method comprising:
forming a lower electrode on a substrate; forming a first insulating layer over the lower electrode; forming a via in the first insulating layer and connected to the lower electrode; forming an upper electrode over the lower electrode, the upper electrode comprising a first electrode and a second electrode; forming a second insulating layer over the upper electrode; forming a first groove between the first electrode and the second electrode, the first groove being deeper than a bottom surface of the upper electrode; and disposing a humidity sensitive layer in the first groove deeper than the bottom surface of the upper electrode.
13 . The method of claim 12 , wherein a bottom of the first groove is between the bottom surface of the upper electrode and a top surface of the lower electrode.
14 . The method of claim 12 , further comprising forming a first protection layer over the humidity sensitive layer.
15 . The method of claim 12 , further comprising forming a pad electrode adjacent to the upper electrode; and
forming a second groove between the first electrode and the pad electrode.
16 . The method of claim 15 , wherein the second groove is deeper than the first groove.
17 . The method of claim 12 , wherein the second electrode comprises discrete electrodes.
18 . The method of claim 17 , wherein the humidity sensitive layer is disposed between each of a pair of adjacent discrete electrodes.
19 . The method of claim 17 , wherein the discrete electrodes are not connected to each other on a plane having the first electrode.Join the waitlist — get patent alerts
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