Support plate system for elevated flooring tiles

1 . A method of constructing an elevated flooring surface, comprising:
 locating a plurality of support pedestals upon a fixed surface with a predetermined spacing between the support pedestals;   placing support plates over top surfaces of the plurality of support pedestals; wherein each support plate includes a base having a top surface, a bottom surface opposite to the top surface, a plurality of corner portions, a plurality of outer edge segments disposed between adjacent corner portions, and a locating structure attached to a first of the outer edge segments and extending away from the top surface; wherein a second of the outer edge segments of each support plate is free of locating structures extending away from the top surface; and wherein each support plate includes at least three corner portions that are respectively disposed over the top surfaces of at least three of the support pedestals; and   positioning each of a plurality of surface tiles over a respective one of the support plates so that one of a plurality of outer edge segments of the surface tile abuts the locating structure of the first outer edge segment of the support plate, wherein each surface tile includes a top surface, a bottom surface opposite to the top surface, and a plurality of corner portions, wherein each outer edge segment of each support tile is disposed between adjacent corner portions of the surface tile, wherein at least one adhesive secures the bottom surface of each surface tile to the top surface of the one of the support plates, and wherein the top surfaces of the surface tiles collectively form the elevated flooring surface over the fixed surface.   
     
     
         2 . The method of  claim 1 , wherein the placing step occurs after the locating step. 
     
     
         3 . The method of  claim 1 , wherein a locating structure is attached to a third of the outer edge segments and extends away from the top surface. 
     
     
         4 . The method of  claim 3 , wherein the positioning step includes positioning each surface tile over the respective one of the support plates so that a second of the outer edge segments of the surface tile abuts the locating structure of the third outer edge segment of the support plate. 
     
     
         5 . (canceled) 
     
     
         6 . (canceled) 
     
     
         7 . The method of  claim 1 , further including:
 securing the support plates to the top surfaces of the support pedestals.   
     
     
         8 . (canceled) 
     
     
         9 . The method of  claim 1 , further including:
 disposing the at least one adhesive onto the top surfaces of the support plates and/or onto the bottom surface of each of the plurality of surface tiles.   
     
     
         10 . The method of  claim 9 , wherein the disposing step occurs after the placing step. 
     
     
         11 . (canceled) 
     
     
         12 . (canceled) 
     
     
         13 . The method of  claim 9 , wherein the at least one adhesive is in a semi-solid or substantially solid state during the disposing step. 
     
     
         14 . The method of  claim 13 , wherein the at least one adhesive is at least one strip of adhesive. 
     
     
         15 . (canceled) 
     
     
         16 . The method of  claim 13 , wherein the at least one adhesive is inorganic. 
     
     
         17 . The method of  claim 13 , wherein the at least one adhesive is organic. 
     
     
         18 . The method of  claim 9 , wherein the at least one adhesive is in a fluid state during the disposing step. 
     
     
         19 . The method of  claim 18 , further including allowing the at least one adhesive to solidify into a solid state after the disposing step. 
     
     
         20 . (canceled) 
     
     
         21 . The method of  claim 19 , wherein the at least one adhesive is substantially free of solvents after the step of allowing the at least one adhesive to solidify. 
     
     
         22 . The method of  claim 19 , wherein the at least one adhesive is substantially free of solvents before the step of allowing the at least one adhesive to solidify. 
     
     
         23 . (canceled) 
     
     
         24 . The method of  claim 18 , wherein the at least one adhesive is inorganic or organic. 
     
     
         25 - 51 . (canceled) 
     
     
         52 . The method of  claim 3 , wherein the first outer edge segment of the support plate is opposite the third outer edge segment of the support plate. 
     
     
         53 . The method of  claim 3 , wherein the first outer edge segment of the support plate is adjacent the third outer edge segment of the support plate. 
     
     
         54 . The method of  claim 1 , wherein each support pedestal includes a base member that rests on the fixed surface, a support member, and a central section that interconnects the base member and support member, wherein the support plates are disposed on top surfaces of the support members of the support pedestals.