Polishing liquid and method for polishing substrate using the polishing liquid

Abstract

Provided is a polishing liquid including cerium oxide particles, an organic acid A, a polymer compound B having a carboxyl acid group or a carboxylate group, and water, wherein the organic acid A has at least one group selected from the group consisting of —COOM group, -Ph-OM group, —SO 3 M group and —PO 3 M 2 group, pKa of the organic acid A is less than 9, a content of the organic acid A is 0.001 to 1 mass % with respect to the total mass of the polishing liquid, and a content of the polymer compound B is 0.01 to 0.50 mass % with respect to the total mass of the polishing liquid, and pH is in the range of 4.0 to 7.0.

1 . A polishing liquid for chemical mechanical polishing comprising: cerium oxide particles, an organic acid A, a polymer compound B having a carboxyl acid group or a carboxylate group, and water,
 wherein the organic acid A is propionic acid,   a content of the organic acid A is 0.001 to 1 mass % with respect to the total mass of the polishing liquid,   a content of the polymer compound B is 0.01 to 0.50 mass % with respect to the total mass of the polishing liquid, and   a pH of the polishing liquid is in the range of 4.0 to 7.0.   
     
     
         2 . The polishing liquid according to  claim 1 , wherein the polishing liquid is stored as a two liquid-type polishing liquid consisting of a first liquid comprising the cerium oxide particles and the water, and a second liquid comprising the organic acid A, the polymer compound B and the water,
 wherein the first liquid and a second liquid are combined prior to use, thereby forming the polishing liquid.   
     
     
         3 . The polishing liquid according to  claim 2 , wherein the first liquid further comprises a dispersant. 
     
     
         4 . A substrate polishing method for polishing a polishing target film formed on a surface of a substrate, the method comprising the steps of:
 (a) providing a polishing target film formed on a surface of a substrate;   (b) providing the polishing liquid according to  claim 1 ; and   (c) polishing the polishing target film with the polishing liquid according to  claim 1 .   
     
     
         5 . A substrate polishing method for polishing a polishing target film formed on a surface of a substrate, the method comprising the steps of:
 (a) providing a polishing target film formed on a surface of a substrate;   (b) providing the polishing liquid according to  claim 2 ; and   (c) polishing the polishing target film with the polishing liquid according to  claim 2 .   
     
     
         6 . A substrate polishing method for polishing a polishing target film formed on a surface of a substrate, the method comprising the steps of:
 (a) providing a polishing target film formed on a surface of a substrate;   (b) providing the polishing liquid according to  claim 3 ; and   (c) polishing the polishing target film with the polishing liquid according to  claim 3 .   
     
     
         7 . The polishing liquid according to  claim 1 , wherein the polymer compound B is poly(meth)acrylic acid.