US2017115039A1PendingUtilityA1

Thermoelectric based heat pump configuration

Assignee: AMI IND INCPriority: Oct 21, 2015Filed: Oct 21, 2015Published: Apr 27, 2017
Est. expiryOct 21, 2035(~9.2 yrs left)· nominal 20-yr term from priority
H10W 40/43F25B 21/02F25B 2321/023F25B 2321/0251F25B 2321/0211F25B 21/04F25B 2321/0212H05K 7/20136H05K 7/2029F25B 2321/0252H10N 10/13H10N 19/00
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Claims

Abstract

A heat exchange system for exchanging heat with an object may include a centrifugal blower for directing air flow in a downward and an outward direction, a heat sink base positioned to receive the air flow from the centrifugal blower, a diffuser on the heat sink base and in the path of the air flow from the centrifugal blower, the diffuser having vanes that are in thermal communication with the heat sink base that direct the air flow from the blower outward over the heat sink base, and a thermoelectric device having a low temperature side and a high temperature side, where the thermoelectric device is in thermal communication with the heat sink base on the low temperature side and the high temperature side.

Claims

exact text as granted — not AI-modified
1 . A heat exchange system for exchanging heat with an object comprising:
 a centrifugal blower for directing air flow in a downward and an outward direction;   a heat sink base positioned to receive the air flow from the centrifugal blower;   a diffuser on the heat sink base and in the path of the air flow from the centrifugal blower, the diffuser having vanes that are in thermal communication with the heat sink base that direct the air flow from the blower outward over the heat sink base; and   a thermoelectric device having a low temperature side and a high temperature side,
 wherein the thermoelectric device is in thermal communication with the heat sink base on the low temperature side and the high temperature side. 
   
     
     
         2 . The heat exchange system of  claim 1 , wherein the object with which heat is being exchanged is an electronic device generating heat during use, and the electronic device is in thermal communication with the heat sink. 
     
     
         3 . The heat exchange system of  claim 1 , wherein the object with which heat is being exchanged is a mechanical device, and the mechanical device is in thermal communication with the heat sink. 
     
     
         4 . The heat exchange system of  claim 1 , wherein the object with which heat is being exchanged is a second heat exchange system. 
     
     
         5 . The heat exchange system of  claim 1 , wherein the object with which heat is being exchanged comprises a phase change material. 
     
     
         6 . The heat exchange system of  claim 1 , wherein the object with which heat is being exchanged comprises a liquid cold plate. 
     
     
         7 . The heat exchange system of  claim 1 , wherein inlet air directed into each heat sink may come from the same source. 
     
     
         8 . The heat exchange system of  claim 1 , wherein the inlet air directed into each heat sink may come from different sources. 
     
     
         9 . The heat exchange system of  claim 1 , wherein the system may operate in a low power consumption mode where one or more of the motor and the thermoelectric device may be unpowered. 
     
     
         10 . The heat exchange system of  claim 4 , further comprising:
 a second centrifugal blower for directing the air flow in an upward and outward direction with respect to the centrifugal blower;   a second heat sink base in thermal communication with the second centrifugal blower and in further connection with the thermoelectric device, the second heat sink base positioned to receive the air flow from the second blower, wherein   the thermoelectric device is in thermal communication with the heat sink base on the high temperature side; and   a second diffuser on the second heat sink base and in the path of the air flow, the second diffuser having vanes that are in thermal communication with the second heat sink base that direct the air flow from the second blower outward over the second heat sink base.   
     
     
         11 . The heat exchange system of  claim 10 , wherein the first and second centrifugal blowers are driven by a common device and operate at the same speed. 
     
     
         12 . The heat exchange system of  claim 10 , wherein the second centrifugal blower has an operational speed that is variable with respect to an operational speed of the first centrifugal blower. 
     
     
         13 . The heat exchange system of  claim 10 , wherein a heat spreader is configured to be between the thermoelectric device and one of the first heat sink base and the second heat sink base. 
     
     
         14 . The heat exchange system of  claim 10 , wherein inlet air directed into each heat sink may come from the same source. 
     
     
         15 . The heat exchange system of  claim 10 , wherein the inlet air directed into each heat sink may come from different sources. 
     
     
         16 . The heat exchange system of  claim 10 , wherein the device may operate in a low power consumption mode where one or more of the motor and the thermoelectric device may be unpowered. 
     
     
         17 . The heat exchange system of  claim 10 , wherein the thermoelectric device is in direct connection with a cold plate, and a direction of an electric current passed through the thermoelectric device changes a direction of heat exchange. 
     
     
         18 . A method for exchanging heat with an object, the method comprising:
 directing an air flow through a first centrifugal blower in a downward and an outward direction;   directing the air flow from the first centrifugal blower outward over a first heat sink base via a first diffuser on the heat sink base and in a path of the air flow from the blower, the diffuser having vanes that are in thermal communication with the heat sink base,   receiving heat from the air flow via the first heat sink base; and   exchanging heat with the object via a thermoelectric device having a low temperature side and a high temperature side, wherein the thermoelectric device is in thermal communication with the heat sink base.

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