Synthesis of superconducting nb-sn

Abstract

A method comprising: electrodepositing a film comprising a Nb—Sn material onto a copper substrate surface from an electrolyte bath comprising (a) SnCl 2 , (b) NbCl 5 , and (c) (i) 1-Ethyl-3-methylimidazolium chloride (EMIC), (ii) 1-Butyl-3-methylimidazolium chloride (BMIC), or (iii) a mixture thereof.

What is claimed is: 
     
         1 . A method comprising:
 electrodepositing a film comprising a Nb—Sn material onto a copper substrate surface from an electrolyte bath comprising (a) SnCl 2 , (b) NbCl 5 , and (c) (i) 1-Ethyl-3-methylimidazolium chloride (EMIC), (ii) 1-Butyl-3-methylimidazolium chloride (BMIC), or (iii) a mixture thereof.   
     
     
         2 . The method of  claim 1 , wherein the bath comprises (a) SnCl 2 , (b) NbCl 5 , and (c) 1-Butyl-3-methylimidazolium chloride (BMIC). 
     
     
         3 . The method of  claim 1 , wherein prior to initiation of electrodeposition (a) is present in an amount of 1 mol % to 50 mol %, (b) is present in an amount of 1 mol % to 50 mol %, and (c) is present in an amount of 1 to 99 mol %. 
     
     
         4 . The method of  claim 1 , wherein the film comprises Nb 3 Sn. 
     
     
         5 . The method of  claim 1 , wherein the electrodeposition occurs at 1 to 1000 mA/cm 2  and 0 to 150° C. for 1 to 7200 seconds. 
     
     
         6 . The method of  claim 1 , wherein the Nb—Sn film has a structure of cubic Nb 3 Sn, orthorhombic NbSn 2 , η Cu 6 Sn 5  and ε Cu 3 Sn. 
     
     
         7 . A method comprising:
 electrodepositing a seed copper layer onto a surface of a Nb substrate;   electrodepositing a tin layer onto the seed copper layer;   electrodepositing a copper barrier layer onto the tin layer to form an intermediate construct; and   heating the intermediate construct to form a Nb 3 Sn coating.   
     
     
         8 . The method of  claim 7 , wherein the heating of the intermediate construct is from 10 to 90° C. 
     
     
         9 . The method of  claim 7 , wherein the Nb 3 Sn coating has a structure of cubic Nb 3 Sn, orthorhombic NbSn 2 , η Cu 6 Sn 5  and ε Cu 3 Sn.