Aluminum EMI / RF Shield

Abstract

A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing shielding materials. The shield for circuitry on a circuit board comprising an aluminum material plated with a solderable material, the shield providing electromagnetic interference and radio frequency interference shielding and heat transfer when positioned over a circuit.

What is claimed is: 
     
         1 . A shield attached to a circuit board for providing electromagnetic interference and radio frequency interference shielding and heat transfer when positioned over a circuit, the shield comprising:
 aluminum plated with a solderable material.   
     
     
         2 . The shield of  claim 1 , wherein the aluminum comprises an aluminum based alloy. 
     
     
         3 . The shield of  claim 1 , wherein the solderable material comprises at least one of nickel or tin. 
     
     
         4 . The shield of  claim 1 , wherein the shield comprises a top wall and one or more side walls. 
     
     
         5 . The shield of  claim 4 , further comprising heat dissipating fins attached to the top wall of the shield. 
     
     
         6 . The shield of  claim 1 , wherein the shield is a one piece shield. 
     
     
         7 . The shield of  claim 1 , wherein the shield is a two piece shield comprising a fence and a lid attached to the fence. 
     
     
         8 . The shield of  claim 1 , wherein the shield is peelable. 
     
     
         9 . The shield of  claim 1 , wherein the shield is non-peelable. 
     
     
         10 . A circuit shield assembly comprising:
 a circuit board including circuitry thereon;   a shield containing aluminum plated with a solderable material, the shield attached to the circuit board enclosing at least a portion of the circuitry, the shield transferring heat generated by the circuitry from a top surface of the shield to the circuit board, the shield providing electromagnetic interference and radio frequency interference shielding.   
     
     
         11 . The shield of  claim 10 , wherein the aluminum comprises an aluminum based alloy. 
     
     
         12 . The shield of  claim 10 , wherein the solderable material comprises at least one of nickel or tin. 
     
     
         13 . The shield of  claim 10 , wherein the shield comprises a top wall and one or more side walls. 
     
     
         14 . The shield of  claim 13 , wherein the shield further comprises heat dissipating fins attached to the top wall. 
     
     
         15 . The shield assembly of  claim 13 , wherein heat is transferred from the top wall of the shield down side walls of the shield. 
     
     
         16 . The shield of  claim 10 , wherein the shield is a one piece shield. 
     
     
         17 . The shield of  claim 10 , wherein the shield is a two piece shield comprising a fence and a lid attached to the fence. 
     
     
         18 . The shield assembly of  claim 17 , wherein the fence is attached the circuit board and surrounds at least a portion of the circuitry. 
     
     
         19 . The shield of  claim 10 , wherein the shield is peelable. 
     
     
         20 . The shield of  claim 10 , wherein the shield is non-peelable.