Method of manufacturing printed wiring board, and printed wiring board

Abstract

On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes preparing a CFRP core, forming a through hole so as to penetrate the CFRP core from the front surface side to the back surface side and include a region in which the component is to be mounted when viewed in a plan view, and embedding a GFRP core having insulating properties within the through hole by filling the through hole with a resin having insulating properties and curing the resin. According to the manufacturing method, the component mounted on the printed board is not affected by a stray capacitance due to a CFRP, and it is not difficult to form a circuit.

1 . A method of manufacturing a printed wiring board, comprising:
 preparing a core having a front surface and a back surface and containing a carbon fiber reinforced plastic;   forming a first through hole penetrating said core from a side having said front surface to a side having said back surface;   filling said first through hole with a paste-like resin containing an inorganic filler;   forming a second through hole which defines, together with said first through hole, an outer edge of a region to serve as said printed wiring board, by penetrating said core from the side having said front surface to the side having said back surface and partially overlapping said first through hole when viewed in a plan view;   filling said second through hole with another resin containing an inorganic filler; and   cutting said core along said outer edge defined by said first through hole and said second through hole.   
     
     
         2 . A method of manufacturing a printed wiring board on which a predetermined component is to be mounted on at least one of a front surface side and a back surface side, comprising:
 preparing a core containing a carbon fiber reinforced plastic;   providing a through hole so as to penetrate said core from said front surface side to said back surface side and include a region in which said component is to be mounted when viewed in a plan view, and thereafter forming a first through hole by applying plating to an inner peripheral surface of said through hole;   closing said back surface side of said first through hole;   arranging a fiber reinforced plastic having insulating properties so as to be included in said first through hole; and   embedding said fiber reinforced plastic within said first through hole by filling a gap between said first through hole and said fiber reinforced plastic within said first through hole, with a resin having insulating properties, and curing said resin.   
     
     
         3 . A method of manufacturing a printed wiring board, comprising:
 preparing a core having a front surface and a back surface and containing a carbon fiber reinforced plastic;   providing a through hole penetrating said core from a side having said front surface to a side having said back surface, and thereafter forming a first through hole by applying plating to an inner peripheral surface of said through hole;   filling said first through hole with a resin containing an inorganic filler;   forming a second through hole which defines, together with said first through hole, an outer edge of a region to serve as said printed wiring board, by penetrating said core from the side having said front surface to the side having said back surface and partially overlapping said first through hole when viewed in a plan view;   filling said second through hole with another resin containing an inorganic filler; and   cutting said core along said outer edge defined by said first through hole and said second through hole.