Light Emitting Diode Mounting Structure

Abstract

A mounting structure for mounting a set of optoelectronic devices is provided. A mounting structure for a set of optoelectronic devices can include: a body formed of an insulating material; and a heatsink element embedded within the body. A heatsink can be located adjacent to the mounting structure. The set of optoelectronic devices can be mounted on a side of the mounting structure opposite of the heatsink.

What is claimed is: 
     
         1 . A device comprising:
 a set of optoelectronic devices;   a mounting structure for the set of optoelectronic devices, wherein the mounting structure includes:
 a body formed of an insulating material; and 
 a heatsink element embedded within the body; and 
 a heatsink located adjacent to the mounting structure. 
   
     
     
         2 . The device of  claim 1 , wherein the mounting structure further includes a set of metal contacts that are connected to a set of electrodes for each optoelectronic device. 
     
     
         3 . The device of  claim 2 , wherein the set of metal contacts connect the set of optoelectronic devices. 
     
     
         4 . The device of  claim 2 , wherein the set of electrodes and the embedded heatsink element each include a magnetic component configured to facilitate automatic alignment of each optoelectronic device on the mounting structure. 
     
     
         5 . The device of  claim 2 , further comprising a set of integrated circuit (IC) control components located between the mounting structure and the heatsink, wherein the set of IC control components are configured to control each optoelectronic device. 
     
     
         6 . The device of  claim 1 , further comprising a second set of optoelectronic devices and a second mounting structure, wherein the second set of optoelectronic devices and the second mounting structure are located on an opposite side of the heatsink as the set of optoelectronic devices and the mounting structure. 
     
     
         7 . The device of  claim 1 , wherein the set of optoelectronic devices form a thin film transistor (TFT) active matrix arrangement. 
     
     
         8 . The device of  claim 1 , wherein the heatsink includes a plurality of cooling channels. 
     
     
         9 . The device of  claim 1 , wherein the heatsink includes a first domain and a second domain and each domain includes a plurality of fins. 
     
     
         10 . The device of  claim 1 , wherein the set of optoelectronic devices include UV LEDs. 
     
     
         11 . A device comprising:
 a first optoelectronic device mounted on a first mounting structure;   a second optoelectronic device mounted on a second mounting structure, wherein each mounting structure includes:
 a body formed of an insulating material; and 
 a heatsink element embedded within the body; and 
   a heatsink, wherein the first mounting structure and the second mounting structure are located on opposite sides of the heatsink.   
     
     
         12 . The device of  claim 11 , wherein the first and second mounting structures each include a set of metal contacts that are connected to a set of electrodes for each optoelectronic device. 
     
     
         13 . The device of  claim 12 , wherein the set of electrodes and the embedded heatsink element each include a magnetic component configured to facilitate automatic alignment of each optoelectronic device on the each mounting structure. 
     
     
         14 . The device of  claim 11 , wherein the heatsink includes a plurality of cooling channels. 
     
     
         15 . The device of  claim 14 , wherein the heatsink is formed of a porous material. 
     
     
         16 . The device of  claim 11 , wherein the heatsink includes a first domain and a second domain and each domain includes a plurality of fins. 
     
     
         17 . A method comprising:
 providing a heatsink including an embedded heatsink element protruding from a lateral surface of the heatsink;   depositing an insulating material over the heatsink to form a mounting structure; and   mounting an optoelectronic device onto the mounting structure.   
     
     
         18 . The method of  claim 17 , further comprising depositing a set of metal contacts onto a surface of the mounting structure prior to mounting the optoelectronic device. 
     
     
         19 . The method of  claim 18 , wherein mounting the optoelectronic device includes electrically connecting a set of electrodes of the optoelectronic device to the set of metal contacts. 
     
     
         20 . The method of  claim 19 , wherein electrically connecting the set of electrodes of the optoelectronic device to the set of metal contacts includes soldering.