Glass-based substrate with vias and process of forming the same

Abstract

A glass sensor substrate including metallizable through vias and related process is provided. The glass substrate has a first major surface, a second major surface and an average thickness of greater than 0.3 mm. A plurality of etch paths are created through the glass substrate by directing a laser at the substrate in a predetermined pattern. A plurality of through vias through the glass substrate are etched along the etch paths using a hydroxide based etching material. The hydroxide based etching material highly preferentially etches the substrate along the etch path. Each of the plurality of through vias is long compared to their diameter for example such that a ratio of the thickness of the glass substrate to a maximum diameter of each of the through vias is greater than 8 to 1.

What is claimed is: 
     
         1 . A process for forming vias in a glass-based substrate having a first major surface and an opposing second major surface, the process comprising:
 creating a plurality of etch paths extending from the first major surface of the glass substrate by directing a laser at the substrate in a predetermined pattern; and   etching a plurality of vias extending from the first major surface of the glass substrate along the etch paths using a hydroxide based etching material, wherein the hydroxide based etching material preferentially etches the substrate along the etch path such that an etch rate of the etching material along the etch path is at least 12 times greater than an etch rate of the etching material outside of the etch paths.   
     
     
         2 . The process of  claim 1 , wherein each of the plurality of vias have a ratio of the length of the via to a maximum diameter of the via is greater than 8 to 1. 
     
     
         3 . The process of  claim 1 , wherein at least one of the plurality of vias is a through via. 
     
     
         4 . The process of  claim 1 , wherein at least one of the plurality of vias is a blind via. 
     
     
         5 . The process of  claim 1 , wherein the laser is a picosecond laser. 
     
     
         6 . The process of  claim 1 , wherein the maximum diameter of each of the plurality of vias is less than 100 μm and a ratio of a minimum diameter to the maximum diameter of each of the vias is greater than 0.5 
     
     
         7 . The process of  claim 1 , further comprising filling the plurality of vias with an electrically conductive material. 
     
     
         8 . The process of  claim 1 , wherein the glass-based substrate includes 50-75 mol % SiO2 and 10-20 mol % alkali metal oxide, where the alkali metal oxide is at least one of Li 2 O, Na 2 O, K 2 O, Rb 2 O and Cs 2 O. 
     
     
         9 . The process of  claim 8 , further comprising tempering the glass-based substrate following etching such that the first major surface and the second major surface are under compressive stress, wherein the compressive stress at one or both of the first and major surfaces is at least 100 MPa. 
     
     
         10 . The process of  claim 9 , wherein the tempering step comprises chemically tempering the glass-based substrate through ion exchange such that chemically strengthened layers extend from the first and second major surfaces, wherein a depth of each chemically strengthened layer is greater than 10 μm, and wherein the compressive stress at one or both of the first and major surfaces is at least 500 MPa. 
     
     
         11 . The process of  claim 1 , wherein the hydroxide based etching material has a hydroxide concentration of at least 0.5 M and is maintained at a temperature of greater than 60 degrees C. during the etching step, and wherein the hydroxide based etching material preferentially etches the substrate along the etch path such that the etch rate of the etching material along the etch path is at least 30 times greater than the etch rate of the etching material outside of the etch paths. 
     
     
         12 . The process of  claim 11 , wherein the hydroxide based etching material includes at least one of sodium hydroxide, potassium hydroxide and tetramethylammonium hydroxide in an aqueous mixture with at least one of a diol and an alcohol. 
     
     
         13 . The process of  claim 1 , wherein the glass-based material has an average thickness of greater than 0.3 mm. 
     
     
         14 . The process of  claim 1 , wherein the glass-based material is glass. 
     
     
         15 . The process of  claim 1 , wherein the glass-based material a glass-ceramic. 
     
     
         16 . A glass-based substrate comprising:
 a first major surface;   a second major surface opposite the first major surface;   an interior region located between the first and second major surfaces; and   a plurality of vias extending from the first major surface into the interior region, each of the vias having a maximum diameter and a minimum diameter;   wherein the substrate has an average thickness of greater than 0.3 mm;   wherein the maximum diameter of each of the plurality of vias is less than 100 μm; and   wherein a ratio of the minimum diameter to the maximum diameter of each of the vias is greater than 0.5.   
     
     
         17 . The glass-based substrate of  claim 16 , wherein the minimum diameter of each of the vias is greater than or equal to 40 μm, and wherein the ratio of the minimum diameter to the maximum diameter of each of the through holes is greater than 0.8 and less than 1. 
     
     
         18 . The glass-based substrate of  claim 16 , wherein a ratio of the length of each via to the maximum diameter of each via is greater than 8 to 1. 
     
     
         19 . The glass-based substrate of  claim 18 , wherein the length of each via is greater than 0.5 mm and less than 1.1 mm, and wherein the ratio of the length of each via to the maximum diameter of each of via is greater than 10 to 1. 
     
     
         20 . The glass-based substrate of  claim 16 , wherein the substrate is a includes 50-75 mol % SiO2 and 10-20 mol % alkali metal oxide, where the alkali metal oxide is at least one of Li 2 O, Na 2 O, K 2 O, Rb 2 O and Cs 2 O. 
     
     
         21 . The glass-based substrate of  claim 16 , wherein the substrate is a tempered glass material wherein the first major surface and the second major surfaces are under compressive stress, and wherein the compressive stress at one or both of the first and second major surfaces is at least 100 MPa. 
     
     
         22 . The glass-based substrate of  claim 21 , wherein the substrate is a chemically tempered glass material having chemically strengthened layers extending from the first and second major surfaces, wherein the depths of the chemically strengthened layers are greater than 10 μm, and wherein the compressive stress at one or both of the first and major surfaces is at least 500 MPa. 
     
     
         23 . The glass-based substrate of  claim 16 , further comprising:
 an electrically conductive material located in the vias;   a first redistribution layer located on the first major surface;   a second redistribution layer located on the second major surface; and   a capacitance sensing array coupled to the first redistribution layer.   
     
     
         24 . The glass-based substrate of  claim 16 , wherein at least one the plurality of vias is a through-via. 
     
     
         25 . The glass-based substrate of  claim 16 , wherein at least one of the plurality of vias is a blind via. 
     
     
         26 . A glass substrate comprising:
 a first major surface;   a second major surface opposite the first major surface;   a plurality of through vias extending between the first and second major surfaces, each of the through holes having a maximum diameter and a minimum diameter; and   a multicomponent glass material including 50-75 mol % SiO2 and 10-20 mol % alkali metal oxide, where the alkali metal oxide is at least one of Li 2 O, Na 2 O, K 2 O, Rb 2 O and Cs 2 O.   wherein the average distance between the first major surface and the second major surface is greater than 0.3 mm;   wherein a ratio of the average distance between the first major surface and the second major surface to a maximum diameter of each of the plurality of through vias is greater than 8 to 1; and   wherein a ratio of the minimum diameter to the maximum diameter of each of the vias is greater than 0.5.   
     
     
         27 . The glass substrate of  claim 26 , wherein the average distance between the first major surface and the second major surface is greater than 0.5 mm and less than 1.1 mm, wherein the maximum diameter of the through holes is less than 100 μm, and wherein the ratio of the average distance between the first major surface and the second major surface to the maximum diameter of each of the through vias is greater than 10 to 1. 
     
     
         28 . The glass substrate of  claim 26 , wherein the substrate is a chemically tempered glass material having chemically strengthened layers extending from the first and second major surfaces, wherein a depth of each chemically strengthened layer is greater than 10 μm, and wherein the first major surface and the second major surfaces are under compressive stress and the compressive stress at the surface of one or both of the first and second major surfaces is at least 100 MPa. 
     
     
         29 . A consumer electronic product, comprising:
 a housing having a front surface, a back surface and side surfaces;   electrical components provided at least partially within the housing, the electrical components including at least a controller, a memory, a fingerprint sensor, and a display, the display being provided at or adjacent the front surface of the housing; and   the glass-based substrate of  claim 16  disposed over the display, wherein the plurality of vias are filled with an electrical conductive material that provides a conductive pathway for the fingerprint sensor.   
     
     
         30 . A consumer electronic product, comprising:
 a housing having a front surface, a back surface and side surfaces;   electrical components provided at least partially within the housing, the electrical components including at least a controller, a memory, a fingerprint sensor, and a display, the display being provided at or adjacent the front surface of the housing; and   the glass substrate of  claim 26  disposed over the display, wherein the plurality of through vias are filled with an electrical conductive material that provides a conductive pathway for the fingerprint sensor.