Semiconductor device and method of manufacturing the same

Abstract

A semiconductor device includes a semiconductor chip, a bump contact, and encapsulating layer, an insulating layer and a connection terminal.

1 - 20 . (canceled) 
     
     
         21 . A package, comprising:
 a substrate;   a semiconductor chip comprising a first surface adjacent to the substrate and a second surface on the opposite side of the semiconductor chip from the first surface, wherein the semiconductor chip comprises a plurality of contacts disposed on the second surface;   an encapsulating layer disposed over the second surface of the semiconductor chip and over the plurality of contacts;   an insulating layer disposed over the encapsulating layer; and   a plurality of connection terminals disposed in the insulating layer.   
     
     
         22 . The package of  claim 21 , wherein the contacts comprise bump contacts. 
     
     
         23 . The package of  claim 21 , wherein the insulating layer has a third surface adjacent to the encapsulating layer and has a fourth surface on the opposite side of the insulating layer from the encapsulating layer, and wherein the connection terminals extend beyond the fourth surface. 
     
     
         24 . The package of  claim 21 , further comprising a fixing material disposed between the substrate and the first surface of the semiconductor chip. 
     
     
         25 . The package of  claim 21 , wherein the substrate comprises silicon. 
     
     
         26 . The package of  claim 21 , wherein the encapsulating layer comprises epoxy resin. 
     
     
         27 . The package of  claim 21 , wherein the connection terminals comprise gold.