Ceramic electronic component

Abstract

A ceramic electronic component includes a first fired electrode layer disposed on top of a ceramic body. The first fired electrode layer includes first to fifth portions that are separate from each other. The first portion is disposed on top of a first end surface. The second portion is disposed on top of a first principal surface. The third portion is disposed on top of a second principal surface. The fourth portion is disposed on top of a first side surface. The fifth portion is disposed on top of a second side surface.

What is claimed is: 
     
         1 . A ceramic electronic component comprising:
 a ceramic body including a first principal surface and a second principal surface that extend in a length direction and in a width direction, a first side surface and a second side surface that extend in the length direction and in a thickness direction, and a first end surface and a second end surface that extend in the width direction and in the thickness direction; and   an outer electrode disposed on the ceramic body and including a fired electrode layer disposed on the ceramic body; wherein   the fired electrode layer includes:
 a first portion disposed on the first end surface; 
 a second portion disposed on the first principal surface; and 
 a third portion disposed on the second principal surface; 
   when viewed in a cross section along the length direction and the thickness direction, the first portion and the second portion are not directly connected to each other, and are separate from each other; and   when viewed in a cross section along the length direction and the thickness direction, the first portion and the third portion are not directly connected to each other, and are separate from each other.   
     
     
         2 . The ceramic electronic component according to  claim 1 , wherein the outer electrode further includes a Cu plating layer arranged to cover the first portion, the second portion, and the third portion. 
     
     
         3 . The ceramic electronic component according to  claim 2 , wherein the Cu plating layer is arranged to cover at least one of the separate portions between the first portion, the second portion, and the third portion. 
     
     
         4 . The ceramic electronic component according to  claim 1 , wherein the fired electrode layer has a maximum thickness of about 20 μm or less. 
     
     
         5 . The ceramic electronic component according to  claim 1 , wherein the ceramic electronic component is buried in a substrate. 
     
     
         6 . The ceramic electronic component according to  claim 1 , wherein an edge portion defined by the first end surface and one of the first principal surface, the second principal surface, the first side surface, and the second side surface has a rounded shape having an equivalent radius of curvature of about 5 μm to about 20 μm. 
     
     
         7 . The ceramic electronic component according to  claim 1 , wherein the ceramic electronic component is one of a multilayer ceramic capacitor, a piezoelectric component, a thermistor and an inductor. 
     
     
         8 . The ceramic electronic component according to  claim 1 , wherein the ceramic body has a thickness of approximately 0.1 mm to approximately 0.5 mm, a length of approximately 0.4 mm to approximately 1.0 mm, and a width of approximately 0.2 mm to approximately 0.5 mm. 
     
     
         9 . The ceramic electronic component according to  claim 1 , wherein the ceramic body is made of one of a dielectric ceramic, a piezoelectric ceramic, a semiconductor ceramic, and a magnetic ceramic. 
     
     
         10 . The ceramic electronic component according to  claim 1 , wherein the ceramic body includes first and second inner electrodes alternately disposed in the thickness direction. 
     
     
         11 . The ceramic electronic component according to  claim 10 , wherein each of the first inner electrodes and each of the second inner electrodes that are adjacent in the thickness direction face each other with a ceramic portion located therebetween. 
     
     
         12 . The ceramic electronic component according to  claim 11 , wherein the ceramic portion has a thickness of approximately 0.4 μm to approximately 0.8 μm. 
     
     
         13 . The ceramic electronic component according to  claim 11 , wherein the ceramic portion has a thickness of approximately 0.3 μm to approximately 0.5 μm. 
     
     
         14 . The ceramic electronic component according to  claim 10 , wherein each of the first and second inner electrodes has a thickness of approximately 0.2 μm to approximately 2.0 μm. 
     
     
         15 . The ceramic electronic component according to  claim 1 , further comprising another outer electrode including a fired electrode layer and a Cu plating layer. 
     
     
         16 . The ceramic electronic component according to  claim 15 , wherein the first electrode layer of the another outer electrode includes:
 a first portion disposed on the second end surface;   a second portion disposed on the first principal surface and including at least a portion that is separate from the first portion;   a third portion disposed on the second principal surface and including at least a portion that is separate from the first portion;   a fourth portion disposed on the first side surface and including at least a portion that is separate from each of the first portion, the second portion, and the third portion; and   a fifth portion disposed on the second side surface and including at least a portion that is separate from each of the first portion, the second portion, and the third portion.   
     
     
         17 . The ceramic electronic component according to  claim 16 , wherein the Cu plating layer of the another outer electrode covers the first, second, third, fourth and fifth portions and corner portions and edge portions of the ceramic body. 
     
     
         18 . The ceramic electronic component according to  claim 1 , wherein a thickness of the fired electrode layer is approximately 20 μm. 
     
     
         19 . The ceramic electronic component according to  claim 15 , wherein a thickness of the fired electrode layer of the another outer electrode is approximately 20 μm.