US2017089648A1PendingUtilityA1
Adhesive-thermal gasket
Est. expirySep 24, 2035(~9.2 yrs left)· nominal 20-yr term from priority
Inventors:Xiaoning Wu
H10W 40/70H10W 40/25F28D 2021/0028F28F 2275/025F28D 15/0275F28F 9/26F28F 21/02
21
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Claims
Abstract
An adhesive-thermal gasket, including: a body of thermally conductive material having a set of openings formed through the body; and an adhesive disposed into each opening for holding together a heat-generating component and a heat-dissipating structure as the body thermally couples the heat-generating component to the heat-dissipating structure.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An adhesive-thermal gasket, comprising:
a body of thermally conductive material having a set of openings formed through the body; and an adhesive disposed into each opening for holding together a heat-generating component and a heat-dissipating structure as the body thermally couples the heat-generating component to the heat-dissipating structure.
2 . The adhesive-thermal gasket of claim 1 , wherein the openings are formed through a periphery of the body.
3 . The adhesive-thermal gasket of claim 1 , wherein a height of the body is greater than a height of the adhesives in the openings.
4 . The adhesive-thermal gasket of claim 1 , wherein the thermally conductive material is a thermal pad.
5 . The adhesive-thermal gasket of claim 1 , wherein the thermally conductive material is a thermal phase-change material.
6 . The adhesive-thermal gasket of claim 1 , wherein the thermally conductive material is a graphite thermal interface material.
7 . The adhesive-thermal gasket of claim 1 , wherein the adhesive in each opening is a pressure sensitive adhesive.
8 . The adhesive-thermal gasket of claim 1 , wherein at least one of the openings has a substantially rectangular shape.
9 . The adhesive-thermal gasket of claim 1 , wherein at least one of the openings has a substantially semicircular shape.
10 . A method for forming an adhesive-thermal gasket, comprising:
forming a body of thermally conductive material; forming a set of openings through the body; and disposing an adhesive into each opening for holding together a heat-generating component and a heat-dissipating structure as the body thermally couples the heat-generating component to the heat-dissipating structure.
11 . The method of claim 10 , wherein forming a set of openings comprises forming a set of openings through a periphery of the body.
12 . The method of claim 10 , wherein disposing an adhesive comprises disposing such that a height of the body is greater than a height of the adhesives in the openings.
13 . The method of claim 10 , wherein forming a body comprises forming using a thermal pad.
14 . The method of claim 10 , wherein forming a body comprises forming using a thermal phase-change material.
15 . The method of claim 10 , wherein forming a body comprises forming using a graphite thermal interface material.
16 . The method of claim 10 , wherein disposing an adhesive comprises disposing a pressure sensitive adhesive.
17 . The method of claim 10 , wherein forming a set of openings comprises forming such that at least one of the openings has a substantially rectangular shape.
18 . The method of claim 10 , wherein forming a set of openings comprises forming such that at least one of the openings has a substantially semicircular shape.Join the waitlist — get patent alerts
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