US2017084578A1PendingUtilityA1

Flexibly-wrapped integrated circuit die

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Assignee: INTEL CORPPriority: Dec 19, 2013Filed: Dec 2, 2016Published: Mar 23, 2017
Est. expiryDec 19, 2033(~7.4 yrs left)· nominal 20-yr term from priority
Inventors:Sven AlbersMichael P. SkinnerHans-Joachim BarthPeter BaumgartnerHarald Gossner
H10W 72/834H10W 72/879H10W 72/50H10W 72/5434H10W 90/753H10W 90/754H10W 90/755H10W 90/752H10W 72/5453H10W 72/5445H10W 72/07554H10W 72/923H10W 72/59H10W 72/01925H10W 44/248H10W 90/00H10W 72/07536H10W 72/07237H10W 72/07236H10W 72/07227H10W 72/07202H10W 72/07204H10W 90/724H10W 72/244H10W 72/07254H10W 72/252H10W 72/253H10W 44/20H10W 20/42H10W 20/497H10W 40/22H10W 70/60H10W 42/20H10W 90/288H10W 72/242H10W 72/20H10W 72/00H10W 42/121H10W 42/00H01L 2225/06506H01L 2225/06589H01L 2224/48137H01L 2224/16225H01L 23/562H01L 27/0207H01L 23/3675H01L 23/66H01L 24/49H01L 2224/48091H01L 23/552H01L 2224/48106H01L 25/0652H01L 2224/16113H01L 2223/6677H01L 2224/73257H10D 89/10H10D 62/117
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Claims

Abstract

Embodiments of a flexibly-wrapped integrated circuit die device and a method for mounting a flexibly-wrapped integrated circuit die to a substrate are disclosed. In some embodiments, the flexibly-wrapped integrated circuit die device includes a substrate and a flexible integrated circuit die coupled to the substrate in a substantially vertical orientation with reference to a surface of the substrate.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An integrated circuit die device comprising:
 a substrate; and   a curved integrated circuit die coupled to the substrate in a substantially vertical orientation with reference to a surface of the substrate.   
     
     
         2 . The integrated circuit die device of  claim 1  wherein the curved integrated circuit die comprises a segmented substrate material comprising a plurality of linked segments. 
     
     
         3 . The integrated circuit die device of  claim 1  wherein the curved integrated circuit die comprises an active side and an inactive side. 
     
     
         4 . The integrated circuit die device of  claim 3  wherein the active side comprises additional electronic circuitry with reference to the inactive side. 
     
     
         5 . The integrated circuit die device of  claim 1  and further comprising bonding wires coupling electronic circuitry on the curved integrated circuit die to circuitry on the substrate. 
     
     
         6 . The integrated circuit die device of  claim 1  and further comprising at least one integrated circuit die coupled to the substrate in a substantially horizontal orientation with reference to the curved integrated circuit die, wherein the curved integrated circuit die wraps around at least a portion of the periphery of the at least one integrated circuit die. 
     
     
         7 . The integrated circuit die device of  claim 6  wherein electronic circuitry on the curved integrated circuit die is coupled to the at least one integrated circuit die with one or more bonding wires. 
     
     
         8 . The integrated circuit die device of  claim 6  wherein the curved integrated circuit die is coupled to the substrate in a circular pattern around the periphery of the at least one integrated circuit die. 
     
     
         9 . The integrated circuit die device of  claim 8  wherein ends of the curved integrated circuit die are coupled together. 
     
     
         10 . The integrated circuit die device of  claim 1  and further comprising a shield formed on an inactive side of the curved integrated circuit die.

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