US2017084567A1PendingUtilityA1

Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement

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Assignee: INFINEON TECHNOLOGIES AGPriority: Sep 5, 2014Filed: Nov 29, 2016Published: Mar 23, 2017
Est. expirySep 5, 2034(~8.1 yrs left)· nominal 20-yr term from priority
Inventors:Friedrich Kroener
H10W 90/736H10W 72/07353H10W 72/07352H10W 72/07336H10W 72/01935H10W 72/01351H10W 72/01336H10W 72/01335H10W 72/01315H10W 72/953H10W 72/952H10W 72/944H10W 72/925H10W 72/353H10W 72/352H10W 72/334H10W 72/325H10W 72/322H10W 72/321H10W 72/073H10W 72/59H10W 72/013B23K 35/32B23K 1/0016H01L 2224/8382H01L 2924/351H01L 2224/29111H01L 2924/014H01L 24/83H01L 2224/29139B23K 35/0238B23K 35/36B23K 2201/40H01L 24/29H01L 2224/29247H01L 2224/29271H01L 2224/29083H01L 2224/29144B23K 2101/40B23K 35/302B23K 35/0233B23K 35/0244B23K 35/3006B23K 35/007B23K 35/3013B23K 2103/172B32B 15/14
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Claims

Abstract

A preform structure for soldering a semiconductor chip arrangement includes a carbon fiber composite sheet and a solder layer formed over the carbon fiber composite sheet.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method for forming a preform structure for a semiconductor chip arrangement, the method comprising:
 heat-pressing of carbon fibers and a supplementary material to obtain a carbon fiber composite sheet; and   forming a preform structure based on the carbon fiber composite sheet.   
     
     
         2 . The method according to  claim 1 , wherein the supplementary material comprises copper powder. 
     
     
         3 . The method according to clam  1 , wherein the supplementary material comprises chromium or copper plated onto the carbon fibers. 
     
     
         4 . The method according to clam  1 , depositing an electrically conductive layer over at least one of a first lateral side and a second lateral side of the carbon fiber composite sheet. 
     
     
         5 . The method according to  claim 4 , further comprising depositing a solder layer over the electrically conductive layer. 
     
     
         6 . The method according to clam  5 , further comprising smoothing the surface of the electrically conductive layer so that a surface roughness of the solder layer formed over the carbon fiber composite sheet is less than 2 μm. 
     
     
         7 . The method according to clam  1 , further comprising individualizing the carbon fiber composite sheet into a plurality of preform structures. 
     
     
         8 . A method for soldering a semiconductor chip arrangement, the method comprising:
 arranging a preform structure between a semiconductor chip and a carrier structure, wherein a surface area of a lateral side of the preform structure is smaller than a surface area of a lateral side of the semiconductor chip; and   soldering the semiconductor chip arrangement.   
     
     
         9 . The method according to  claim 8 , wherein the preform structure comprises a carbon fiber composite sheet and a solder layer formed over the carbon fiber composite sheet. 
     
     
         10 . The method according to  claim 8 , wherein the soldering is done by diffusion soldering.

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