US2017082891A1PendingUtilityA1

Liquid crystal display and method of manufacturing the same

Assignee: SAMSUNG DISPLAY CO LTDPriority: Feb 17, 2014Filed: Nov 29, 2016Published: Mar 23, 2017
Est. expiryFeb 17, 2034(~7.6 yrs left)· nominal 20-yr term from priority
G02F 1/133345G02F 1/133377G02F 1/1368G02F 2201/121G02F 1/1341G02F 2202/20G02F 2201/123H10D 86/441H10D 86/60H10D 86/021G02F 2202/02G02F 1/1334
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Claims

Abstract

A liquid crystal display includes: a substrate; a thin film transistor; a pixel electrode; a roof layer; a liquid crystal layer; and a plurality of partitions. The thin film transistor is disposed on the substrate. The pixel electrode is connected to the thin film transistor. The roof layer is disposed to face the pixel electrode. The liquid crystal layer is formed by a plurality of microcavities between the pixel electrode and the roof layer, wherein the microcavities include a liquid crystal material. The partitions are between the microcavities adjacent to each other, wherein the partitions may include an organic material and are arranged side by side to one another.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of manufacturing a liquid crystal display, comprising:
 forming a thin film transistor on a substrate;   forming a pixel electrode connected to the thin film transistor;   forming a sacrificial layer on the pixel electrode;   forming an insulating layer on the sacrificial layer;   forming an organic layer on the insulating layer;   patterning the insulating layer by using the organic layer as a mask;   removing the sacrificial layer to form a plurality of microcavities;   patterning the organic layer; and   injecting a liquid crystal material to the microcavities,   wherein the patterning of the organic layer includes removing the organic layer disposed at a portion corresponding to each of the microcavities and forming a plurality of partitions between the microcavities adjacent to each other.   
     
     
         2 . The method of  claim 1 , wherein
 the partitions comprise an organic material and are arranged side by side to one another.   
     
     
         3 . The method of  claim 2 , wherein
 the forming of the sacrificial layer includes forming an opening at a portion overlapping a data line connected to the thin film transistor.   
     
     
         4 . The method of  claim 3 , wherein
 the insulating layer is formed in the opening.   
     
     
         5 . The method of  claim 4 , wherein
 the partitions are formed along a direction that the opening extends.   
     
     
         6 . The method of  claim 1 , further comprising
 forming a roof layer on the insulating layer after patterning the organic layer.   
     
     
         7 . The method of  claim 6 , wherein
 the partitions are formed between the roof layer and the insulating layer.   
     
     
         8 . The method of  claim 7 , wherein
 the roof layer and the insulating layer comprise an inorganic material.   
     
     
         9 . The method of  claim 8 , wherein
 the roof layer contacts the insulating layer in a region corresponding to the microcavities.   
     
     
         10 . The method of  claim 9 , further comprising
 forming a capping layer in a liquid crystal injection portion,   wherein the liquid crystal injection portion is formed between the microcavities.   
     
     
         11 . The method of  claim 10 , further comprising
 forming a common electrode under the insulating layer and facing the pixel electrode with respect to the microcavities, and the common electrode and the insulating layer are patterned by using the organic layer as a mask.

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