US2017080696A1PendingUtilityA1
Methods and apparatus for transfer for films among substrates
Est. expiryDec 7, 2032(~6.4 yrs left)· nominal 20-yr term from priority
Inventors:Bruce Ira Willner
H10P 90/12H10P 72/0442H10P 72/0428B32B 38/10B32B 2037/243B32B 2037/246B32B 37/24C01B 31/0446C01B 31/0484C01B 32/184C01B 32/194B32B 38/08
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Claims
Abstract
A method is disclosed which includes: forming at least one layer of material on at least part of a surface of a first substrate, wherein a first surface of the at least one layer of material is in contact with the first substrate thereby defining an interface; attaching a second substrate to a second surface of the at least one layer of material; forming bubbles at the interface; and applying mechanical force; whereby the second substrate and the at least one layer of material are jointly separated from the first substrate. Related arrangements are also described.
Claims
exact text as granted — not AI-modifiedI claim:
1 . A method comprising:
forming at least one layer of material on at least part of a surface of a first substrate, wherein a first surface of the at least one layer of material is in contact with the first substrate thereby defining an interface; attaching a second substrate to a second surface of the at least one layer of material; forming bubbles at the interface; and applying mechanical force; whereby the second substrate and the at least one layer of material are jointly separated from the first substrate.Join the waitlist — get patent alerts
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