Method and apparatus for inspecting a substrate

Abstract

A method and apparatus for inspection and review of defects is disclosed wherein data gathering is improved. In one embodiment, multiple or segmented detectors are used in a particle beam system.

1 - 41 . (canceled) 
     
     
         42 . A method of inspecting or reviewing a substrate, comprising:
 a. exposing at least a portion of said substrate, thereby causing said substrate to emit charged particles;   b. detecting said charged particles with a first detector element;   c. detecting said charged particles with a second detector element; and   d. combining signals from said first detector element and said second detector element, such that topographical data concerning said substrate is enhanced.   
     
     
         43 . The method of  claim 42 , wherein said signals are subtracted from one another. 
     
     
         44 . The method of  claim 43 , wherein material contrast is suppressed. 
     
     
         45 . The method of  claim 42 , wherein said signals are in analog form when combined. 
     
     
         46 . The method of  claim 42 , wherein said signals are digitized before being combined. 
     
     
         47 . The method of  claim 42 , wherein said signals are summed. 
     
     
         48 . The method of  claim 42 , wherein said signal combination is controlled to create a predetermined mix of topographic and material contrast. 
     
     
         49 . A system for inspecting or reviewing a substrate, comprising:
 an incident beam that exposes at least a portion of said substrate, thereby causing said substrate to emit charged particles;   a first detector element for detecting said charged particles to obtain first signal;   a second detector element for detecting said charged particles to obtain second signal; and   a device that combines the first and second signals to generate a combined signal,   wherein the first and second signals are combined such that topographical data concerning the substrate is enhanced in the combined signal.   
     
     
         50 . The system of  claim 49 , further comprising:
 a digitizer for digitizing the combined signal to generate combined digital data; and   a computer that receives the combined digital data.   
     
     
         51 . The system of  claim 50 , wherein the computer obtains rendered data in suitable format for comparison with the combined digital data, and wherein the computer compares the combined digital data to the rendered data for purpose of inspecting or reviewing the substrate. 
     
     
         52 . The system of  claim 49 , further comprising:
 a digitizer for digitizing the first signal and the second signal to generate, respectively, first digital data and second digital data; and   a computer that combines the first digital data and the second digital data to generate combined digital data.   
     
     
         53 . The system of  claim 52 , wherein the computer obtains rendered data in suitable format for comparison with the combined digital data, and wherein the computer compares the combined digital data to the rendered data for purpose of inspecting or reviewing the substrate. 
     
     
         54 . The system of  claim 49 , wherein the first signal is subtracted from the second signal to generate the combined signal. 
     
     
         55 . The system of  claim 54 , wherein material contrast is suppressed in the combined signal. 
     
     
         56 . The system of  claim 49 , wherein the first signal is added to the second signal to generate the combined signal. 
     
     
         57 . The system of  claim 50 , wherein the combined signal is controlled to create a predetermined mix of topographical and material contrast. 
     
     
         58 . The system of  claim 49 , wherein said charged particles comprise secondary electrons.