Insertable electrode device that does not generate acid mist or other gases, and method

Abstract

The invention relates to an insertable electrode device (DEI) for metal electrowinning processes, said device being non-polluting since it does not generate acid mist or other gases. The principle is based on an oxidation half-cell reaction occurring inside the DEI, together with the reduction half-cell that occurs in the metal electrowinning cell using same. The DEI does not generate gases and therefore does not emit acid mist into the environment. The DEI replaces current anodes and permits oxidation reactions to occur below the energy threshold of electrolysis of water, thereby preventing the electro-generation of gaseous oxygen, which is the main cause of acid mist. The DEI comprises a peripheral frame, ion exchange membranes, a strategic electrode that is a strategic semiconductor or conductor (CSE), an inlet duct and outlet duct, a horizontal conductive rod, vertical electrical conducting bars, handles or clamps, a strategic electrolyte, a distributing rod, a discharge rod, and circulation inlet holes and circulation outlet holes.

1 . Insertable electrode device (IED), which replaces the traditional anode in metal electrowinning processes, which does riot generate acid mist or other gases, wherein the IED comprises;
 a) a peripheral frame ( 2 ) arranged on both sides of the device in matching manner and facing each other, each supporting and stabilizing the;   b) ion exchange membranes ( 3 ) formed of polymeric material and watertight, with electrically charged fixed groups, wherein contained in between such membranes is a;   c) strategic electrode which is a strategic conductor or semiconductor SCS ( 4 ), wherein said elements form a monolithic unit that is the insertable electrode device IED ( 1 ) or cartridge, and joining of the elements that comprise it is achieved through seals and fastening means, wherein mounting is performed of an;   d) inlet duct ( 5 ) and an;   e) outlet duct ( 6 ), wherein both pipelines are located at the top of IED device ( 1 ); wherein the SCS ( 4 ) contained within the IED ( 1 ) is connected at the top horizontal portion to a;   f) horizontal conductive bar ( 7 ), wherein;   g) electrically conductive vertical bars ( 8 ) allow to physically hold the IED ( 1 ) device that is connected as a whole to a set of;   h) handles or clamps ( 9 ) that permit connection between the vertical conductive bars ( 8 ) and the horizontal conductive bar ( 7 ), wherein inside the device circulates;   i) a strategic electrolyte ( 10 ), which is distributed by a;   j) distribution bar ( 11 ) connected to the inlet duct ( 5 ) and flows towards a;   k) discharge bar ( 12 ) connected to the outlet duct ( 6 ), wherein the strategic electrolyte ( 10 ) enters pressurized through;   l) circulation inlet bores ( 13 ) located on the distribution bar ( 11 ) and exits through;   m) circulation outlet bores ( 14 ) located on the discharge bar ( 12 ).   
     
     
         2 . Insertable electrode device (IED), which replaces the traditional anode in metal electrowinning processes, which does not generate acid mist or other gases, according to  claim 1  wherein a strategic electrolyte ( 10 ) circulates inside the device (IED) ( 1 ) that is an aqueous medium containing the ion pair to be used for the anodic half-cell reaction, which in the case of copper will be the Fe (II)/Fe (III) couple. 
     
     
         3 . Insertable electrode device (IED), which replaces the traditional anode in metal electrowinning processes, which does not generate acid mist or other gases, according to  claim 1 , wherein the shape and dimensions of the device (IED) ( 1 ) are variable as a mobile unitary container to suit the shape and dimensions of the conventional electrolytic cell (CEC) where it will be used; wherein the device considers and allows the possibility of giving it different volumetric shapes. 
     
     
         4 . Insertable electrode device (IED) that replaces the traditional anode in metal electrowinning processes, which does not generate acid mist or other gases, according to  claim 1 , wherein the IED is of rectangular shape. insertable electrode device (IED) that replaces the traditional anode in metal electrowinning processes, which does not generate acid mist or other gases, according to  claim 1 , wherein the IED is of cylindrical shape. 
     
     
         6 . Insertable electrode device (IED) that replaces the traditional anode in metal electrowinning processes, which does not generate acid mist or other gases, according to  claim 1 , wherein the IED is of a shape with special geometries as required by a given specific application. 
     
     
         7 . Insertable electrode device (IED) that replaces the traditional anode in metal electrowinning processes, which does not generate acid mist or other gases, according to  claim 1 , wherein the strategic conductor or semiconductor (SCS) ( 4 ) located inside the insertable electrode device (IED) ( 1 ) is configured with the condition of mass electrode. 
     
     
         8 . Insertable electrode device (IED) that replaces the traditional anode in metal electrowinning processes, which does not generate acid mist or other gases, according to  claim 1 , wherein the strategic conductor or semiconductor (SCS) ( 4 ) located inside the insertable electrode device (IED) ( 1 ) is a mesh electrode. 
     
     
         9 . Insertable electrode device (IED) that replaces the traditional anode in metal electrowinning processes, which does not generate acid mist or other gases, according to  claim 1 , wherein the strategic conductor or semiconductor (SCS) ( 4 ) located inside the insertable electrode device (IED) ( 1 ) it is a plate electrode. 
     
     
         10 . Insertable electrode device (IED) that replaces the traditional anode in metal electrowinning processes, which does not generate acid mist or other gases, according to  claim 1 , wherein the material of the strategic conductor or semiconductor (SCS) ( 4 ) can be metals, graphite, graphene, coated iridium oxide, tantalum or ruthenium metals. 
     
     
         11 . Procedure for applying the insertable electrode device (IED) of  claim 1 , wherein mounting of the (IED) comprises the following steps;
 a) discharging rich electrolyte (RE) from the conventional cells, withdrawing lead conventional cathodes and anodes;   b) mounting the (IED) at positions corresponding to conventional lead anodes and interleaved between the positions of the conventional cathodes;   c) connecting the piping of the (SE) external recirculation system;   d) preparing (SE) solutions in the recirculation tank;   e) mounting cathodes in the conventional cell;   f) propelling the strategic electrolyte (SE) toward the (IED);   g) propelling the rich electrolyte (RE) in the conventional cell;   h) energizing the electrolytic container, setting the current required by the process.