Multi-layer forms and methods of manufacturing the same

Abstract

Multi-layer forms and methods of producing the same are disclosed. An example apparatus includes means for moving a first substrate in a direction; means for applying adhesive to a first portion of a first side of the first substrate; means for mating a second substrate with the first portion; means for applying adhesive to a third portion of a second side of the first substrate; means for folding the first substrate about a first fold line to couple the third portion to a fourth portion of the second side; means for applying adhesive to a first sub-portion of a second portion of the first side; and means for folding the first substrate and the second substrate about a second fold line to couple a face of the first sub-portion and a face of a second sub-portion of the second portion and to position the first substrate between the second substrate.

What is claimed is: 
     
         1 . An apparatus, comprising:
 means for moving a first substrate in a direction, the first substrate comprising a first side opposite a second side, the first side having a first portion and a second portion, the second portion having a first sub-portion and a second sub-portion, the second side having a third portion and a fourth portion;   means for applying adhesive to the first portion of the first side;   means for mating a second substrate with the first portion of the first side;   means for applying adhesive to the third portion of the second side;   means for folding the first substrate about a first fold line to couple the third portion to the fourth portion;   means for applying adhesive to the first sub-portion of the second portion; and   means for folding the first substrate and the second substrate about a second fold line to couple a face of the first sub-portion and a face of the second sub-portion and to position the first substrate between the second substrate.   
     
     
         2 . The apparatus of  claim 1 , further comprising means for positioning an inlay on the first substrate or the second substrate. 
     
     
         3 . The apparatus of  claim 1 , further comprising means for embossing the first substrate and the second substrate to enable the first substrate and the second substrate to include indicia prior to folding the first substrate about the first fold line 
     
     
         4 . An apparatus, comprising:
 a first substrate first ply comprising a first surface and a second surface;   a second substrate first ply comprising a first surface and a second surface, the second surface of the first substrate first ply coupled to the first surface of the second substrate first ply, the first substrate first ply and the second substrate first ply being embossed;   a second substrate second ply comprising a first surface and a second surface, the second substrate first ply is disposed between the second substrate second ply and the first substrate first ply;   a first substrate second ply comprising a first surface and a second surface, the first surface of the first substrate second ply coupled to the second surface of the second substrate second ply, the first substrate second ply and the second substrate second ply not being embossed.   
     
     
         5 . The apparatus of  claim 4 , further comprising a line of weakness through the first substrate first ply, the second substrate first ply, the first substrate second ply, and the second substrate second ply to define a removable portion. 
     
     
         6 . The apparatus of  claim 4 , further comprising a second substrate third ply comprising a first surface and a second surface, the second surface of the second substrate first ply coupled to the first surface of the second substrate third ply. 
     
     
         7 . The apparatus of  claim 6 , wherein the second substrate third ply is not embossed. 
     
     
         8 . The apparatus of  claim 7 , further comprising a second substrate fourth ply comprising a first surface and a second surface, the second surface of the second substrate third ply coupled to the first surface of the second substrate fourth ply. 
     
     
         9 . The apparatus of  claim 8 , wherein the second substrate fourth ply is not embossed. 
     
     
         10 . The apparatus of  claim 8 , wherein the second surface of the second substrate fourth ply is coupled to the first surface of the second substrate second ply. 
     
     
         11 . The apparatus of  claim 10 , further comprising a line of weakness through the first substrate first ply, the first substrate second ply, the second substrate first ply, the second substrate second ply, the second substrate third ply, and the second substrate fourth ply to define a removable portion. 
     
     
         12 . The apparatus of  claim 11 , wherein the removable portion comprises at least one of a card, a tag, an ornament, or a card and key tag. 
     
     
         13 . The apparatus of  claim 11 , further comprising a perforation through the first substrate first ply, the first substrate second ply, the second substrate first ply, the second substrate second ply, the second substrate third ply, and the second substrate fourth ply to define a cutout. 
     
     
         14 . An apparatus, comprising:
 a first substrate first layer comprising a first side and a second side;   a second substrate first layer comprising a third side and a fourth side, the second side coupled to the third side, the first substrate first layer and the second substrate first layer being embossed;   a second substrate second layer comprising a fifth side and a sixth side, the fourth side coupled to the fifth side;   a first substrate second layer comprising a seventh side and an eighth side, the seventh side coupled to the sixth side, the first substrate second layer and the second substrate second layer not being embossed.   
     
     
         15 . The apparatus of  claim 14 , wherein the third side comprises imaging. 
     
     
         16 . The apparatus of  claim 14 , further comprising a line of weakness through the first and second substrate first layers and the first and second substrate second layers to define a card surrounded by a waste matrix. 
     
     
         17 . The apparatus of  claim 14 , further comprising a line of weakness through the first and second substrate first layers and the first and second substrate second layers to define a removable portion. 
     
     
         18 . The apparatus of  claim 14 , wherein the embossing of the first substrate first layer is ink tipped. 
     
     
         19 . The apparatus of  claim 14 , wherein the first substrate comprises plastic. 
     
     
         20 . The apparatus of  claim 14 , wherein the first substrate comprises an inlay.