Organic light-emitting device and method of manufacturing the same

Abstract

An organic light-emitting device includes a substrate, a bottom electrode on the substrate, an organic light-emitting layer on the bottom electrode, and a top electrode on the organic light-emitting layer, wherein the top electrode includes a first electrode part, a grid-shaped or plate-shaped second electrode part on the first electrode part, and an adhesive layer on the second electrode part.

What is claimed is: 
     
         1 . An organic light-emitting device comprising:
 a substrate;   a bottom electrode on the substrate;   an organic light-emitting layer on the bottom electrode; and   a top electrode on the organic light-emitting layer,   wherein the top electrode comprises a first electrode part, a grid-shaped second electrode part on the first electrode part, and an adhesive layer on the second electrode part.   
     
     
         2 . The organic light-emitting device of  claim 1 , wherein the first electrode part comprises graphene. 
     
     
         3 . The organic light-emitting device of  claim 1 , wherein the first electrode part and the adhesive layer are spaced apart from each other in a direction perpendicular to a top surface of the first electrode part. 
     
     
         4 . The organic light-emitting device of  claim 1 , wherein the second electrode part is surrounded by the adhesive layer, and
 a bottom surface of the second electrode part is in contact with a top surface of the first electrode part.   
     
     
         5 . The organic light-emitting device of  claim 1 , wherein the second electrode part comprises any one of a metal, metal nanoparticles, and metal nanowires. 
     
     
         6 . The organic light-emitting device of  claim 1 , further comprising a conductive polymer between the first electrode part and the second electrode part. 
     
     
         7 . A method of manufacturing an organic light-emitting device, the method comprising:
 providing a substrate;   forming a bottom electrode on the substrate;   forming an organic light-emitting layer on the bottom electrode; and   transferring a top electrode on the organic light-emitting layer,   wherein the transferring of the top electrode comprises:   providing a graphene layer;   transferring an auxiliary electrode film on the graphene layer; and   bonding a top surface of the organic light-emitting layer and a bottom surface of the graphene layer.   
     
     
         8 . The method of  claim 7 , wherein the transferring of the auxiliary electrode film comprises:
 providing a self-assembled monolayer;   forming a grid-shaped or plate-shaped auxiliary electrode part on the self-assembled monolayer;   forming an adhesive layer on the auxiliary electrode part;   forming a support layer on the adhesive layer;   removing the self-assembled monolayer; and   bonding a bottom surface of the auxiliary electrode part and a top surface of the graphene layer.   
     
     
         9 . The method of  claim 8 , wherein the forming of the grid-shaped auxiliary electrode part comprises:
 forming a photoresist layer on the self-assembled monolayer;   forming a photoresist pattern by etching the photoresist layer;   forming a conductive material layer on the graphene layer; and   lifting off the photoresist pattern.   
     
     
         10 . The method of  claim 8 , wherein the forming of the grid-shaped auxiliary electrode part comprises using an inkjet printing method, an electrohydrodynamic printing method, a gravure offset printing, a gravure printing, a reverse offset printing or a screen printing. 
     
     
         11 . The method of  claim 8 , wherein the forming of the plate-shaped auxiliary electrode part comprises:
 forming a photoresist layer on the self-assembled monolayer;   forming a photoresist pattern by etching the photoresist layer;   forming a conductive material layer on the self-assembled monolayer;   forming a protective layer on the conductive material layer;   removing a portion of the protective layer to expose a top surface of the conductive material layer in contact with a top surface of the photoresist pattern;   exposing the top surface of the photoresist pattern by etching the conductive material layer; and   removing the entire protective layer.   
     
     
         12 . The method of  claim 8 , further comprising removing the support layer after the transferring of the top electrode. 
     
     
         13 . The method of  claim 8 , further comprising:
 providing an auxiliary substrate under the self-assembled monolayer;   forming a photoresist pattern between the auxiliary substrate and the self-assembled monolayer; and   lifting off the photoresist pattern after the forming of the auxiliary electrode part.   
     
     
         14 . The method of  claim 7 , wherein the transferring of the auxiliary electrode film comprises:
 providing an auxiliary substrate;   performing a plasma treatment on a top surface of the auxiliary substrate;   forming a grid-shaped or plate-shaped auxiliary electrode part on the auxiliary substrate;   forming an adhesive layer on the auxiliary electrode part;   forming a support layer on the adhesive layer;   removing the auxiliary substrate; and   bonding a bottom surface of the auxiliary electrode part and a top surface of the graphene layer.