Electronic component device production method and electronic component sealing sheet

Abstract

The electronic component device production method includes a step A of preparing a layered body comprising electronic components immobilized on a support body, a step B of preparing an electronic component sealing sheet, a step C of disposing the electronic component sealing sheet over the electronic components under conditions where the probe tack force of the electronic component sealing sheet is 5 gf or lower according to a probe tack test, a step D of rising the temperature of the electronic component sealing sheet until the probe tack of the electronic component sealing sheet is 10 gf or greater according to the probe tack test to immobilize temporarily the electronic component sealing sheet onto the electronic components, and a step E of embedding the electronic components in the electronic component sealing sheet to form a sealed body comprising the electronic components embedded in the electronic component sealing sheet.

1 . A method for manufacturing an electronic component device, comprising:
 a step A of preparing a laminate in which electronic components are fixed on a support,   a step B of preparing a sheet for sealing an electronic component,   a step C of arranging the sheet for sealing an electronic component on the electronic components under a condition in which the probe tack force of the sheet for sealing an electronic component in a probe tack test is 5 gf or less,   a step D of increasing a temperature of the sheet for sealing an electronic component in a state where the sheet for sealing an electronic component is arranged on the electronic components until the probe tack force of the sheet for sealing an electronic component in a probe tack test becomes 10 gf or more and temporarily fixing the sheet for sealing an electronic component to the electronic components, and   a step E of embedding the electronic components in the sheet for sealing an electronic component to forma sealed body in which the electronic components are embedded in the sheet for sealing an electronic component.   
     
     
         2 . The method for manufacturing an electronic component device according to  claim 1 , wherein the probe tack force of the sheet for sealing an electronic component in a probe tack test is 5 gf or less at 25° C., and 10 gf or more at 40° C. 
     
     
         3 . The method for manufacturing an electronic component device according to  claim 2 , wherein
 the step C is a step of arranging the sheet for sealing an electronic component on the electronic components at 25° C. or lower, and   the step D is a step of increasing a temperature of the sheet for sealing an electronic component to 40° C. or higher and temporarily fixing the sheet for sealing an electronic component to the electronic components.   
     
     
         4 . A sheet for sealing an electronic component having a probe tack force in a probe tack test of 5 gf or less at 25° C. and 10 gf or more at 40° C.