Radiation-sensitive resin composition, resist pattern-forming method, acid generator and compound

Abstract

The present invention provides a radiation-sensitive resin composition that contains a polymer having a structural unit that includes an acid-labile group; and an acid generator, wherein the acid generator includes a compound including a sulfonate anion having SO 3 − , wherein a hydrogen atom or an electron-donating group bonds to an α carbon atom with respect to SO 3 − , and an electron-withdrawing group bonds to a β carbon atom with respect to SO 3 − ; and a radiation-degradable onium cation. The compound preferably has a group represented by the following formula (1-1) or (1-2). In the following formulae (1-1) and (1-2), R 1 and R 2 each independently represent a hydrogen atom or a monovalent electron-donating group. R 3 represent a monovalent electron-withdrawing group. R 4 represents a hydrogen atom or a monovalent hydrocarbon group.

1 - 12 . (canceled) 
     
     
         13 : A radiation-sensitive resin composition, comprising:
 a polymer comprising a structural unit which comprises an acid-labile group; and   at least one acid generator comprising a first acid generator represented by formula (2), and optionally a second acid generator other than the first acid generator:
   (R 5  n X—Z  (2)
 
   
       wherein in the formula (2):
 Z represents a group represented by formula (1-1) or (1-2); 
 X represents —OCO—; 
 n is an integer of 1 to 3; 
 R 5  represents a cycloalkyl group, or a group comprising a lactone structure; 
 in a case where n is no less than 2, a plurality of R 5 s are identical or different; and 
 two or more of Z, X and R 5  optionally bond to each other to form a ring structure, 
 
       
         
           
           
               
               
           
         
       
       wherein in the formulae (1-1) and (1-2):
 R 1  and R 2  each independently represent a hydrogen atom or a methyl group; 
 R 3  represents a trifluoromethyl group; 
 R 4  represents a hydrogen atom; and 
 M +  represents a monovalent radiation-degradable onium cation. 
 
     
     
         14 : The radiation-sensitive resin composition according to  claim 13 ,
 wherein   n in the formula (2) is 1.   
     
     
         15 : The radiation-sensitive resin composition according to  claim 13 , wherein the radiation-degradable onium cation is a sulfonium cation or an iodonium cation. 
     
     
         16 : The radiation-sensitive resin composition according to  claim 13 , wherein the structural unit that includes an acid-labile group is represented by formula (4): 
       
         
           
           
               
               
           
         
         wherein in the formula (4),
 R 7  represents a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group; 
 R 8  represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; 
 R 9  and R 10  each independently represent a monovalent linear hydrocarbon group having 1 to 10 carbon atoms or a monovalent alicyclic hydrocarbon group having 3 to 20 carbon atoms; and 
 R 9  and R 10  optionally taken together represent an alicyclic structure having 3 to 20 carbon atoms together with the carbon atom to which R 9  and R 10  bond. 
 
       
     
     
         17 : The radiation-sensitive resin composition according to  claim 13 , wherein a content of the first acid generator in the at least one acid generator is in a range of 25% by mass to 90% by mass. 
     
     
         18 : The radiation-sensitive resin composition according to  claim 13 , wherein a content of the first acid generator in the at least one acid generator is in a range of 30% by mass to 70% by mass. 
     
     
         19 : The radiation-sensitive resin composition according to  claim 13 , further comprising an acid diffusion controller. 
     
     
         20 : The radiation-sensitive resin composition according to  claim 13 , further comprising a fluorine atom-containing polymer other than the polymer. 
     
     
         21 : The radiation-sensitive resin composition according to  claim 13 , wherein Z represents a group represented by formula (1-1). 
     
     
         22 : The radiation-sensitive resin composition according to  claim 21 , wherein n is 1. 
     
     
         23 : The radiation-sensitive resin composition according to  claim 22 , wherein R 1  and R 2  each represent a hydrogen atom. 
     
     
         24 : A resist pattern-forming method, comprising:
 applying the radiation-sensitive resin composition according to  claim 13  on a substrate to form the resist film;   exposing the resist film; and   developing the exposed resist film.   
     
     
         25 : A compound represented by formula (2):
   (R 5  n X—Z  (2)
   wherein in the formula (2):
 Z represents a group represented by formula (1-1) or (1-2); 
 X represents —OCO—; 
 n is an integer of 1 to 3; 
 R 5  represents a cycloalkyl group, or a group comprising a lactone structure; 
 in a case where n is no less than 2, a plurality of R 5 s are identical or different; and 
 two or more of Z, X and R 5  optionally bond to each other to form a ring structure, 
   
       
         
           
           
               
               
           
         
         wherein in the formulae (1-1) and (1-2):
 R 1  and R 2  each independently represent a hydrogen atom or a methyl group; 
 R 3  represents a trifluoromethyl group; 
 R 4  represents a hydrogen atom; and 
 M +  represents a monovalent radiation-degradable onium cation. 
 
       
     
     
         26 : The compound according to  claim 25 , wherein Z represents a group represented by formula (1-1). 
     
     
         27 : The compound according to  claim 26 , wherein n is 1. 
     
     
         28 : The compound according to  claim 27 , wherein R 1  and R 2  each represent a hydrogen atom.