US2017037536A1PendingUtilityA1
Method and apparatus for the selective deposition of epitaxial germanium stressor alloys
Est. expiryMar 28, 2031(~4.7 yrs left)· nominal 20-yr term from priority
H10P 14/3446H10P 14/3411H10P 14/2905H10P 14/27H10D 84/0165H01L 29/1054H01L 21/02581C23C 16/4586C23C 16/4412H01L 21/02636H01L 21/02532C30B 29/52C30B 25/10C30B 23/06C30B 29/08H01L 21/02381C23C 16/4584C30B 23/063C30B 23/02C23C 16/08C30B 25/14H10D 30/751H10D 30/798H10P 14/24C30B 25/16C30B 23/066
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Claims
Abstract
A method and apparatus for forming heterojunction stressor layers is described. A germanium precursor and a metal precursor are provided to a chamber, and an epitaxial layer of germanium-metal alloy formed on the substrate. The metal precursor is typically a metal halide, which may be provided by subliming a solid metal halide or by contacting a pure metal with a halogen gas. The precursors may be provided through a showerhead or through a side entry point, and an exhaust system coupled to the chamber may be separately heated to manage condensation of exhaust components.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An apparatus for forming a stressor layer on a substrate, comprising:
a rotatable substrate support disposed in an enclosure; a plurality of gas inlets formed in a first wall of the enclosure; at least one gas outlet formed in a second wall of the enclosure; a reactive precursor source coupled to a gas inlet by a first conduit; a non-reactive precursor source coupled to a gas inlet by a second conduit; and an exhaust system comprising a condensation trap.
2 . The apparatus of claim 1 , wherein at least one gas inlet of the plurality of gas inlets is formed in the first wall of the enclosure near the rotatable substrate support.
3 . The apparatus of claim 1 , wherein the exhaust system further comprises jacketed piping and valves.
4 . The apparatus of claim 3 , wherein the exhaust system further comprises a vacuum pump and the jacketed piping ends at an inlet of the vacuum pump.
5 . The apparatus of claim 3 , wherein the exhaust system further comprises an adhesion reducing coating.
6 . The apparatus of claim 1 , wherein the reactive precursor source is coupled to a metal halide source.
7 . The apparatus of claim 1 , wherein the non-reactive precursor source is a germanium hydride source.
8 . The apparatus of claim 1 , further comprising a metal precursor contact chamber coupled with the first conduit, wherein the contact chamber contains a bed of solid metal or metal halide crystals.
9 . The apparatus of claim 8 , further comprising a halogen gas source coupled with the metal precursor contact chamber through a first gas feed conduit.
10 . The apparatus of claim 9 , further comprising a carrier gas source coupled with the metal precursor contact chamber through a second gas feed conduit.
11 . An apparatus for forming a stressor layer on a substrate, comprising:
a rotatable substrate support disposed in an enclosure; a heat source disposed in the enclosure below the rotatable substrate support; a gas inlet formed in a sidewall of the enclosure proximate to an edge of the substrate support and having a flow direction substantially parallel to an upper surface of the rotatable substrate support; a gas outlet formed in a sidewall opposite the gas inlet and proximate to the edge of the rotatable substrate support; a first precursor pathway coupled to the gas inlet and to a germanium hydride source; a second precursor pathway coupled to the gas inlet and to a metal halide source or organometallic halide source; and an exhaust system comprising an exhaust conduit and valves coupling the gas outlet to a vacuum pump, wherein the exhaust conduit is encompassed by a jacket.
12 . The apparatus of claim 11 , wherein the jacket includes resistive heating elements.
13 . The apparatus of claim 11 , further comprising a condensation trap coupled to the exhaust conduit.
14 . The apparatus of claim 11 , wherein the exhaust conduit is coated with quartz or an inert polymer material.
15 . The apparatus of claim 11 , further comprising a metal precursor contact chamber coupled with the second precursor pathway, wherein the contact chamber contains a bed of solid metal or metal halide crystals.
16 . The apparatus of claim 15 , further comprising a halogen gas source coupled with the metal precursor contact chamber through a first gas feed conduit.
17 . The apparatus of claim 16 , further comprising a carrier gas source coupled with the metal precursor contact chamber through a second gas feed conduit.Join the waitlist — get patent alerts
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