Method of manufacturing plate-shaped bonded body, bonding device, and plate-shaped bonded body

Abstract

A method for quickly applying and spreading adhesive between substrates without leaving air bubbles. The method includes holding two substrates apart from each other with adhesive sides facing, a second substrate being positioned above a first substrate. The second substrate is suspended in a manner so as to cause a portion to warp towards the first substrate. After a liquid filler is applied between the two substrates, rollers are lowered onto the second substrate and moved so as to disperse the liquid filler between the first and second substrates. In accordance with the rolling of the rollers, end portions of the second substrate are lowered towards the first substrate.

1 . A plate-shaped bonded body manufactured by a method including:
 a holding step in which respective adhesive surfaces of a first substrate and a second substrate are made to face each other and in which the adhesive surface of the second substrate is held above the first substrate while making the adhesive surface of the second substrate warp towards the first substrate side:   a discharging step in which a dispensing nozzle is inserted into a most approximate position of the first substrate and the second substrate and in which a liquid filler is discharged from the dispensing nozzle while adhering to the first substrate and the second substrate; and   a filling step in which pressing members are disposed on the second substrate at a position corresponding to the most approximate position and in which the liquid filler is fit and spread between the first and second substrates by making the pressing members move on the second substrate,   wherein the second substrate is held in parallel to the first substrate in accordance with moving positions of the pressing members.