Mems micro-mirror assembly
Abstract
A MEMS micro-mirror assembly ( 250, 300, 270, 400 ) comprising, a MEMS device ( 240 ) which comprises a MEMS die ( 241 ) and a magnet ( 231 ); a flexible PCB board ( 205 ) to which the MEMS device ( 240 ) is mechanically, and electrically, connected; wherein the flexible PCB board ( 205 ) further comprises a first extension portion ( 205 b ) which comprises a least one electrical contact ( 259 a,b ) which is useable to electrically connect the MEMS micro-mirror assembly ( 250, 300, 270, 400 ) to another electrical component). There is further provided a projection system comprising such a MEMS micro-mirror assembly ( 250, 300, 270, 400 ).
Claims
exact text as granted — not AI-modified1 - 15 . (canceled).
16 . An apparatus comprising:
a microelectromechanical system (MEMS) device; and a flexible printed circuit board (PCB) coupled to the MEMS device, the flexible PCB comprising at least one electrical contact operable to couple the MEMS device to another electrical component.
17 . The apparatus of claim 16 , the MEMS device mounted on the flexible PCB.
18 . The apparatus of claim 16 , the MEMS device comprising a coil, the at least one electrical contact electrically coupled to the coil.
19 . The apparatus of claim 16 , the MEMS device a mirror to oscillate about at least one axis.
20 . The apparatus of claim 16 , the flexible PCB comprising a first alignment mark, the first alignment mark comprising an indication of a location on the flexible PCB to attach the MEMS device.
21 . The apparatus of claim 20 , the flexible PCB comprising a second alignment mark, the second alignment mark comprising an indication of a location on the flexible PCB to attach a magnet, the magnet to provide a magnetic field to actuate the MEMS device.
22 . The apparatus of claim 16 , the flexible PCB comprising at least one reinforced area.
23 . The apparatus of claim 22 , the at least one reinforced area thicker than other areas of the flexible PCB.
24 . The apparatus of claim 16 , a length of at least one dimension of the flexible PCB board substantially the same as a length of at least one dimension of the MEMS device.
25 . A system comprising:
a light source to emit a light beam; a microelectromechanical system (MEMS) device comprising a micro-mirror to oscillate about at least one oscillation axis, the micro-mirror in an optical path of the light beam; and a flexible printed circuit board (PCB) coupled to the MEMS device, the flexible PCB comprising at least one electrical contact operable to couple the MEMS device to another electrical component.
26 . The system of claim 25 , the MEMS device mounted on the flexible PCB.
27 . The system of claim 25 , the MEMS device comprising a coil, the at least one electrical contact electrically coupled to the coil.
28 . The system of claim 25 , the flexible PCB comprising a first alignment mark, the first alignment mark comprising an indication of a location on the flexible PCB to attach the MEMS device.
29 . The system of claim 28 , the flexible PCB comprising a second alignment mark, the second alignment mark comprising an indication of a location on the flexible PCB to attach a magnet, the magnet to provide a magnetic field to actuate the MEMS device.
30 . The system of claim 29 , comprising the magnet.
31 . The system of claim 25 , the flexible PCB comprising at least one reinforced area.
32 . The system of claim 31 , the at least one reinforced area thicker than other areas of the flexible PCB.
33 . The system of claim 25 , a length of at least one dimension of the flexible PCB board substantially the same as a length of at least one dimension of the MEMS device.
34 . The system of claim 25 , comprising the another electrical component, the another electrical component a power source.
35 . An apparatus comprising:
a die comprising a microelectromechanical system (MEMS) device; and a flexible printed circuit board (PCB) coupled to the MEMS device, the flexible PCB comprising at least one electrical contact operable to couple the MEMS device to another electrical component.
36 . The apparatus of claim 35 , the die mounted to a first side of the flexible PCB.
37 . The apparatus of claim 35 , the at least one electrical contact comprising a first electrical contact and a second electrical contact, the second electrical contact redundant to the first electrical contact.
38 . The apparatus of claim 35 , comprising at least one wire bond to electrically couple the at least one electrical contact to the MEMS device.Join the waitlist — get patent alerts
Track US2017031152A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.